Flip chip, also known as controlled collapse chip connection or its abbreviation, C4,is a method for interconnecting semiconductor devices

The global 2.5D IC Flip Chip Product market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on 2.5D IC Flip Chip Product volume and value at global level, regional level and company level. From a global perspective, this report represents overall 2.5D IC Flip Chip Product market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of 2.5D IC Flip Chip Product in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their 2.5D IC Flip Chip Product manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

The following manufacturers are covered:
TSMC (Taiwan)
Samsung (South Korea)
ASE Group (Taiwan)
Amkor Technology (US)
UMC (Taiwan)
STATS ChipPAC (Singapore)
Powertech Technology (Taiwan)
STMicroelectronics (Switzerland)

Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India

Segment by Type
Copper Pillar
Solder Bumping
Tin-lead eutectic solder
Lead-free solder
Gold Bumping
Others

Segment by Application
Electronics
Industrial
Automotive & Transport
Healthcare
IT & Telecommunication
Aerospace and Defense
Others