Global (United States, European Union and China) Semiconductor Packaging Materials Market Research Report 2019-2025
Semiconductor packages are plastic, ceramic, and metal components that are not only protect fabricated integrated circuits (ICs) on the semiconductor die, but also act as an interconnect between the printed circuit board (PCB) and the die during shipping and handling. These packaging materials safeguard and protect the die from the external mechanical impacts and corrosion, besides acting as an electrically conductive interconnection with excellent signal propagation properties.
The demand for organic substrates semiconductor packaging materials is increasing because the semiconductor packaging industry is advancing towards leadless and cable-less packaging materials. These substrates are replacing the application of lead frames and bonding wires. These substrates are flexible and can also be used as interconnects. Our research analysts have estimated that the IC packaging materials market will witness considerable growth in the organic substrates segment throughout the projected period.
Countries such as Taiwan, China, Japan, and South Korea are the major contributors to the growth of the semiconductor packaging materials market in APAC. The adoption of integrated circuit packaging and semiconductor packaging is increasing in this region due to the growing adoption of consumer electronic goods and smart mobile devices. The focus of the international corporations towards expanding their manufacturing operations in countries such as China, due to the availability of cheap labor, raw materials, and favorable factors of production, will also drive the market’s growth prospects in this region.
In 2019, the market size of Semiconductor Packaging Materials is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Semiconductor Packaging Materials.
This report studies the global market size of Semiconductor Packaging Materials, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
This study presents the Semiconductor Packaging Materials production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.
In global market, the following companies are covered:
Amkor Technology
DuPont
BASF
Henkel
Honeywell
Kyocera
Toppan Printing
Hitachi Chemical
ASM Pacific Technology
Beijing Kehua New Chemical Technology
Market Segment by Product Type
Organic Substrates
Lead Frames
Bonding Wires
Other
Market Segment by Application
IDM (Integrated Device Manufacturers)
OSAT (Outsourced Semiconductor Assembly and Test Companies)
Key Regions split in this report: breakdown data for each region.
United States
China
European Union
Rest of World (Japan, Korea, India and Southeast Asia)
The study objectives are:
To analyze and research the Semiconductor Packaging Materials status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
To present the key Semiconductor Packaging Materials manufacturers, presenting the sales, revenue, market share, and recent development for key players.
To split the breakdown data by regions, type, companies and applications
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
In this study, the years considered to estimate the market size of Semiconductor Packaging Materials are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
The demand for organic substrates semiconductor packaging materials is increasing because the semiconductor packaging industry is advancing towards leadless and cable-less packaging materials. These substrates are replacing the application of lead frames and bonding wires. These substrates are flexible and can also be used as interconnects. Our research analysts have estimated that the IC packaging materials market will witness considerable growth in the organic substrates segment throughout the projected period.
Countries such as Taiwan, China, Japan, and South Korea are the major contributors to the growth of the semiconductor packaging materials market in APAC. The adoption of integrated circuit packaging and semiconductor packaging is increasing in this region due to the growing adoption of consumer electronic goods and smart mobile devices. The focus of the international corporations towards expanding their manufacturing operations in countries such as China, due to the availability of cheap labor, raw materials, and favorable factors of production, will also drive the market’s growth prospects in this region.
In 2019, the market size of Semiconductor Packaging Materials is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Semiconductor Packaging Materials.
This report studies the global market size of Semiconductor Packaging Materials, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
This study presents the Semiconductor Packaging Materials production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.
In global market, the following companies are covered:
Amkor Technology
DuPont
BASF
Henkel
Honeywell
Kyocera
Toppan Printing
Hitachi Chemical
ASM Pacific Technology
Beijing Kehua New Chemical Technology
Market Segment by Product Type
Organic Substrates
Lead Frames
Bonding Wires
Other
Market Segment by Application
IDM (Integrated Device Manufacturers)
OSAT (Outsourced Semiconductor Assembly and Test Companies)
Key Regions split in this report: breakdown data for each region.
United States
China
European Union
Rest of World (Japan, Korea, India and Southeast Asia)
The study objectives are:
To analyze and research the Semiconductor Packaging Materials status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
To present the key Semiconductor Packaging Materials manufacturers, presenting the sales, revenue, market share, and recent development for key players.
To split the breakdown data by regions, type, companies and applications
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
In this study, the years considered to estimate the market size of Semiconductor Packaging Materials are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
Frequently Asked Questions
This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
- By product type
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- By Technology
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The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
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