Global Thermal Interface Material for 5G Market Growth 2022-2028
As the global economy mends, the 2021 growth of Thermal Interface Material for 5G will have significant change from previous year. According to our researcher latest study, the global Thermal Interface Material for 5G market size is USD million in 2022 from USD million in 2021, with a change of % between 2021 and 2022. The global Thermal Interface Material for 5G market size will reach USD million in 2028, growing at a CAGR of % over the analysis period.
The United States Thermal Interface Material for 5G market is expected at value of US$ million in 2021 and grow at approximately % CAGR during review period. China constitutes a % market for the global Thermal Interface Material for 5G market, reaching US$ million by the year 2028. As for the Europe Thermal Interface Material for 5G landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period. In APAC, the growth rates of other notable markets (Japan and South Korea) are projected to be at % and % respectively for the next 5-year period.
Global main Thermal Interface Material for 5G players cover Fuji Polymer Industries Co., Ltd., Laird Technologies, Inc., Henkel Corporation, and Dow, etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.
This report presents a comprehensive overview, market shares, and growth opportunities of Thermal Interface Material for 5G market by product type, application, key manufacturers and key regions and countries.
Segmentation by type: breakdown data from 2017 to 2022, in Section 2.3; and forecast to 2028 in section 12.6
Thermal Pad
Thermal Gel
Thermal Grease
Thermal Tap
Graphite Sheet
Phase Change Material
Thermal Gap Filler
Others (Graphene, Carbon Fiber TIM)
Segmentation by application: breakdown data from 2017 to 2022, in Section 2.4; and forecast to 2028 in section 12.7.
5G Smartphone
5G Base Station
Others (Routers and Servers)
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the prominent manufacturers in this market, include
Fuji Polymer Industries Co., Ltd.
Laird Technologies, Inc.
Henkel Corporation
Dow
W.L. Gore and Associates, Inc.
Panasonic Corporation
Jiangxi Dasen Technology Co., Ltd.
3M Company
Shin-Etsu Chemical Co., Ltd.
Denka Company Limited
JONES TECH PLC
Parker Hannifin Corp
Momentive Performance Materials, Inc.
Dongguan Sheen Electronic Technology Co., Ltd.
T-Global Technology Co., Ltd.
The United States Thermal Interface Material for 5G market is expected at value of US$ million in 2021 and grow at approximately % CAGR during review period. China constitutes a % market for the global Thermal Interface Material for 5G market, reaching US$ million by the year 2028. As for the Europe Thermal Interface Material for 5G landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period. In APAC, the growth rates of other notable markets (Japan and South Korea) are projected to be at % and % respectively for the next 5-year period.
Global main Thermal Interface Material for 5G players cover Fuji Polymer Industries Co., Ltd., Laird Technologies, Inc., Henkel Corporation, and Dow, etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.
This report presents a comprehensive overview, market shares, and growth opportunities of Thermal Interface Material for 5G market by product type, application, key manufacturers and key regions and countries.
Segmentation by type: breakdown data from 2017 to 2022, in Section 2.3; and forecast to 2028 in section 12.6
Thermal Pad
Thermal Gel
Thermal Grease
Thermal Tap
Graphite Sheet
Phase Change Material
Thermal Gap Filler
Others (Graphene, Carbon Fiber TIM)
Segmentation by application: breakdown data from 2017 to 2022, in Section 2.4; and forecast to 2028 in section 12.7.
5G Smartphone
5G Base Station
Others (Routers and Servers)
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the prominent manufacturers in this market, include
Fuji Polymer Industries Co., Ltd.
Laird Technologies, Inc.
Henkel Corporation
Dow
W.L. Gore and Associates, Inc.
Panasonic Corporation
Jiangxi Dasen Technology Co., Ltd.
3M Company
Shin-Etsu Chemical Co., Ltd.
Denka Company Limited
JONES TECH PLC
Parker Hannifin Corp
Momentive Performance Materials, Inc.
Dongguan Sheen Electronic Technology Co., Ltd.
T-Global Technology Co., Ltd.
Frequently Asked Questions
This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
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