Global TCB Bonder Market Insights, Forecast to 2025

Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the die in a process called "Thermo Compression Bonding". The bumps are forced against their opposing pads and a second metallic bond is formed where the bond comes into contact with the package metallization. This technique typically requires the use of heat as high as 350° to 400°C, and forces of as much as 100 g/bump.
Thermo Compression Bonding (TCB) is a chip attach technology under investigation and implementation in multiple platforms. The global TCB Bonder market is driven by increased TCB Bonder usage: memory applications currently, logic devices next. Meanwhile, TCB Bonder is gaining market share from wire bond assembly processes. Also, lower throughput coupled with higher processing costs was example of challenges in the TCB technology.
The leading enterprises in the TCB Bonder market are ASMPT (AMICRA) (HK) and K&S (US), which followed by Besi (NL), Shibaura (JP), SET (FR), and Hanmi (KR). These Top companies currently account for more than 91.03% of the total market share and are expected to retain their dominating hold over the market during the forecast period.
North America TCB Bonder market would keep being the largest market, followed by Europe in 2018. Japan market and China market would rank forth (12 units) and fifth (11 units).
The TCB Bonder market was valued at 33 Million US$ in 2018 and is projected to reach 140 Million US$ by 2025, at a CAGR of 20.0% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for TCB Bonder.

This report presents the worldwide TCB Bonder market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

The following manufacturers are covered in this report:
ASMPT (Amicra)
K&S
BESI
Shibaura
SET
Hamni

TCB Bonder Breakdown Data by Type
Automatic TCB Bonder
Manual TCB Bonder
TCB Bonder Breakdown Data by Application
IDMs
OSAT

TCB Bonder Production by Region
United States
Europe
China
Japan
Other Regions

TCB Bonder Consumption by Region
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Malaysia
Philippines
Thailand
Vietnam
Europe
Germany
France
UK
Italy
Russia
Rest of Europe
Central & South America
Brazil
Rest of South America
Middle East & Africa
GCC Countries
Turkey
Egypt
South Africa
Rest of Middle East & Africa

The study objectives are:
To analyze and research the global TCB Bonder status and future forecast，involving, production, revenue, consumption, historical and forecast.
To present the key TCB Bonder manufacturers, production, revenue, market share, and recent development.
To split the breakdown data by regions, type, manufacturers and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

In this study, the years considered to estimate the market size of TCB Bonder :
History Year: 2014 - 2018
Base Year: 2018
Estimated Year: 2019
Forecast Year: 2019 - 2025

This report includes the estimation of market size for value (million USD) and volume (Units). Both top-down and bottom-up approaches have been used to estimate and validate the market size of TCB Bonder market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.

For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

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