Global Sputtering Target Material Market Analysis 2015-2019 and Forecast 2020-2025

Snapshot

Sputtering is the process of forming a thin film when the object is attached to the target substrate by the sputtering and scattering, and the sputtering target is the material for high-speed particle bombardment. This report studies the sputtering target material market.
The global Sputtering Target Material market size is estimated at xxx million USD with a CAGR xx% from 2015-2019 and is expected to reach xxx Million USD in 2020 with a CAGR xx% from 2020 to 2025. The report begins from overview of Industry Chain structure, and describes industry environment, then analyses market size and forecast of Sputtering Target Material by product, region and application, in addition, this report introduces market competition situation among the vendors and company profile, besides, market price analysis and value chain features are covered in this report.

Product Type Coverage (Market Size & Forecast, Major Company of Product Type etc.):

Metal Target
Alloy Target
Ceramic Compound Target
Company Coverage (Company Profile, Sales Revenue, Price, Gross Margin, Main Products etc.):
JX Nippon Mining & Metals Corporation
TOSOH
Sumitomo Chemical
Mitsui Mining & Smelting
ULVAC
Praxair
Grikin
Plansee
Ningbo Jiangfeng
Honeywell
Materion (Heraeus)
Acetron
Changzhou Sujing Electronic Material
Luoyang Sifon Electronic Materials

Application Coverage (Market Size & Forecast, Different Demand Market by Region, Main Consumer Profile etc.):

Semiconductor
Solar Energy
Flat Panel Display

Region Coverage (Regional Production, Demand & Forecast by Countries etc.):

North America (U.S., Canada, Mexico)
Europe (Germany, U.K., France, Italy, Russia, Spain etc.)
Asia-Pacific (China, India, Japan, Southeast Asia etc.)
South America (Brazil, Argentina etc.)
Middle East & Africa (Saudi Arabia, South Africa etc.)

Frequently Asked Questions