Global Solder Paste Inspection (SPI) System Market Insights, Forecast to 2025
This report studies the Solder Paste Inspection (SPI) System market, Solder Paste Inspection is mainly done to check the solder paste deposits in the Printed Circuit Board (PCB) manufacturing process. It is observed that most of the solder joint defects in a PCB assembly are because of improper solder paste printing. With the help of solder paste inspection (SPI), you can reduce the defects related to soldering by a considerable amount.
Importance of Solder Paste Inspection Process
Here are some of the key points of information, which prove the importance of SPI process:
Improves PCB Quality & Performance: This process makes use of advanced equipment for precise inspection. Angle cameras are used to take 3D pictures, which are very helpful in measuring the alignment and volume of the solder paste. This helps improve the yield, as well as the print quality. Furthermore, it helps improve the performance of the PCBs.
Advanced Equipment for Better Control & Monitoring: As said earlier, angle cameras are used, which produce clear 3D pictures. Unlike the traditional cameras, 3D cameras are capable of capturing the height of the solder paste printed. This facilitates precise measurement of the solder paste volume. Thus, with the help of SPI coupled with automated optical inspection, manufacturers can easily monitor and control the component placement and solder paste printing processes.
Helps Reduce Solder Errors: Important information about the printing process can be obtained by doing the solder paste inspection. It gives a clear idea about the causes of defects, thus allowing you to make the necessary changes and reduce the errors to a minimum.
Numerous studies have been performed over the last few years proving that up to 70% of all SMD solder joint issues, can be traced back to the solder paste printing process. These printing errors may be caused by incorrect printer setup, stencil damage, stencil design or type, solder paste type, solder paste conditions or a collection of several issues.
The global Solder Paste Inspection (SPI) System market concentration rate is high and dominated by several players from Korea, Taiwan, Japan, United States and Germany; Koh Young, MirTec Ltd, PARMI Corp and Pemtron are from Korea; Test Research, Inc (TRI) and Jet Technology from Taiwan; CyberOptics Corporation, Machine Vision Products (MVP), Caltex Scientific and ASC International from United States; and Viscom AG and Vi TECHNOLOGY from Europe. In 2017, Koh Young and Test Research, Inc (TRI) occupied more than 60 percent of global market.
Currently, In-line SPI systems are dominating the market, due to the superior performance and the market demand. The SPI system market is mainly driven by the demand from Automotive and Consumer Electronics; other end market like communications, aerospace and medical fields will play more and more role in future.
The Solder Paste Inspection (SPI) System market was valued at 240 Million US$ in 2018 and is projected to reach 330 Million US$ by 2025, at a CAGR of 4.2% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Solder Paste Inspection (SPI) System.
This report presents the worldwide Solder Paste Inspection (SPI) System market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
The following manufacturers are covered in this report:
Koh Young (Korea)
CyberOptics Corporation
Test Research, Inc (TRI) (Taiwan)
MirTec Ltd (Korea)
PARMI Corp (Korea)
Viscom AG (Germany)
ViTrox (Malaysia)
Vi TECHNOLOGY (France)
Mek (Marantz Electronics) (Japan)
CKD Corporation (Japan)
Pemtron (Korea)
SAKI Corporation (Japan)
Machine Vision Products (MVP) (US)
Caltex Scientific (US)
ASC International (US)
Sinic-Tek Vision Technology (China)
Shenzhen JT Automation Equipment (China)
Jet Technology (Taiwan)
Solder Paste Inspection (SPI) System Breakdown Data by Type
In-line SPI System
Off-line SPI System
Solder Paste Inspection (SPI) System Breakdown Data by Application
Automotive Electronics
Consumer Electronics
Industrials
Others
Solder Paste Inspection (SPI) System Production by Region
United States
Europe
China
Japan
Other Regions
Solder Paste Inspection (SPI) System Consumption by Region
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Malaysia
Philippines
Thailand
Vietnam
Europe
Germany
France
UK
Italy
Russia
Rest of Europe
Central & South America
Brazil
Rest of South America
Middle East & Africa
GCC Countries
Turkey
Egypt
South Africa
Rest of Middle East & Africa
The study objectives are:
To analyze and research the global Solder Paste Inspection (SPI) System status and future forecast，involving, production, revenue, consumption, historical and forecast.
To present the key Solder Paste Inspection (SPI) System manufacturers, production, revenue, market share, and recent development.
To split the breakdown data by regions, type, manufacturers and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
In this study, the years considered to estimate the market size of Solder Paste Inspection (SPI) System :
History Year: 2014 - 2018
Base Year: 2018
Estimated Year: 2019
Forecast Year: 2019 - 2025
This report includes the estimation of market size for value (million USD) and volume (Units). Both top-down and bottom-up approaches have been used to estimate and validate the market size of Solder Paste Inspection (SPI) System market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.
Importance of Solder Paste Inspection Process
Here are some of the key points of information, which prove the importance of SPI process:
Improves PCB Quality & Performance: This process makes use of advanced equipment for precise inspection. Angle cameras are used to take 3D pictures, which are very helpful in measuring the alignment and volume of the solder paste. This helps improve the yield, as well as the print quality. Furthermore, it helps improve the performance of the PCBs.
Advanced Equipment for Better Control & Monitoring: As said earlier, angle cameras are used, which produce clear 3D pictures. Unlike the traditional cameras, 3D cameras are capable of capturing the height of the solder paste printed. This facilitates precise measurement of the solder paste volume. Thus, with the help of SPI coupled with automated optical inspection, manufacturers can easily monitor and control the component placement and solder paste printing processes.
Helps Reduce Solder Errors: Important information about the printing process can be obtained by doing the solder paste inspection. It gives a clear idea about the causes of defects, thus allowing you to make the necessary changes and reduce the errors to a minimum.
Numerous studies have been performed over the last few years proving that up to 70% of all SMD solder joint issues, can be traced back to the solder paste printing process. These printing errors may be caused by incorrect printer setup, stencil damage, stencil design or type, solder paste type, solder paste conditions or a collection of several issues.
The global Solder Paste Inspection (SPI) System market concentration rate is high and dominated by several players from Korea, Taiwan, Japan, United States and Germany; Koh Young, MirTec Ltd, PARMI Corp and Pemtron are from Korea; Test Research, Inc (TRI) and Jet Technology from Taiwan; CyberOptics Corporation, Machine Vision Products (MVP), Caltex Scientific and ASC International from United States; and Viscom AG and Vi TECHNOLOGY from Europe. In 2017, Koh Young and Test Research, Inc (TRI) occupied more than 60 percent of global market.
Currently, In-line SPI systems are dominating the market, due to the superior performance and the market demand. The SPI system market is mainly driven by the demand from Automotive and Consumer Electronics; other end market like communications, aerospace and medical fields will play more and more role in future.
The Solder Paste Inspection (SPI) System market was valued at 240 Million US$ in 2018 and is projected to reach 330 Million US$ by 2025, at a CAGR of 4.2% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Solder Paste Inspection (SPI) System.
This report presents the worldwide Solder Paste Inspection (SPI) System market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
The following manufacturers are covered in this report:
Koh Young (Korea)
CyberOptics Corporation
Test Research, Inc (TRI) (Taiwan)
MirTec Ltd (Korea)
PARMI Corp (Korea)
Viscom AG (Germany)
ViTrox (Malaysia)
Vi TECHNOLOGY (France)
Mek (Marantz Electronics) (Japan)
CKD Corporation (Japan)
Pemtron (Korea)
SAKI Corporation (Japan)
Machine Vision Products (MVP) (US)
Caltex Scientific (US)
ASC International (US)
Sinic-Tek Vision Technology (China)
Shenzhen JT Automation Equipment (China)
Jet Technology (Taiwan)
Solder Paste Inspection (SPI) System Breakdown Data by Type
In-line SPI System
Off-line SPI System
Solder Paste Inspection (SPI) System Breakdown Data by Application
Automotive Electronics
Consumer Electronics
Industrials
Others
Solder Paste Inspection (SPI) System Production by Region
United States
Europe
China
Japan
Other Regions
Solder Paste Inspection (SPI) System Consumption by Region
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Malaysia
Philippines
Thailand
Vietnam
Europe
Germany
France
UK
Italy
Russia
Rest of Europe
Central & South America
Brazil
Rest of South America
Middle East & Africa
GCC Countries
Turkey
Egypt
South Africa
Rest of Middle East & Africa
The study objectives are:
To analyze and research the global Solder Paste Inspection (SPI) System status and future forecast，involving, production, revenue, consumption, historical and forecast.
To present the key Solder Paste Inspection (SPI) System manufacturers, production, revenue, market share, and recent development.
To split the breakdown data by regions, type, manufacturers and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
In this study, the years considered to estimate the market size of Solder Paste Inspection (SPI) System :
History Year: 2014 - 2018
Base Year: 2018
Estimated Year: 2019
Forecast Year: 2019 - 2025
This report includes the estimation of market size for value (million USD) and volume (Units). Both top-down and bottom-up approaches have been used to estimate and validate the market size of Solder Paste Inspection (SPI) System market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.
Frequently Asked Questions
This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
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The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
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