Global Solder Ball Market Study 2016-2026, by Segment (Lead Solder Ball, Lead Free Solder Ball), by Market (BGA, CSP & WLCSP, … …), by Company (Senju Metal, DS HiMetal, … …)
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
The global Solder Ball market will reach Volume Million USD in 2019 and with a CAGR xx% between 2020-2026.
Product Type Coverage (Market Size & Forecast, Major Company of Product Type etc.):
Lead Solder Ball
Lead Free Solder Ball
Demand Coverage (Market Size & Forecast, Consumer Distribution):
CSP & WLCSP
Flip-Chip & Others
Company Coverage (Sales data, Main Products & Services etc.):
Shanghai hiking solder material
Middle East & Africa
Frequently Asked Questions
This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
- By product type
- By End User/Applications
- By Technology
- By Region
The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.