Global Power Module Packaging Market 2018 by Manufacturers, Regions, Type and Application, Forecast to 2023
- SKU ID : GIR-GIR1808030026 12895148
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- Publishing Date: 28-Sep-2018
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- Region: Global
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- No. of pages: 119
A power electronic module or power module acts as a physical container for the storage of several power components, usually power semiconductor devices.
Scope of the Report:
This report focuses on the Power Module Packaging in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
The market growth is driven by reduction in wastage of energy, use of efficient distributed cooling schemes, reduction in footprint, and consequent increase in power density.
The worldwide market for Power Module Packaging is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx million US$ in 2017, according to a new study.
Market Segment by Manufacturers, this report covers
Texas Instruments Incorporated
Star Automations
DyDac Controls
SEMIKRON
IXYS Corporation
Infineon Technologies AG
Mitsubishi Electric Corporation
Fuji Electric Co. Ltd.
Sanken Electric Co., Ltd.
SanRex Corporation
Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
GaN Module
SiC Module
FET Module
IGBT Module
Thyristors
Market Segment by Applications, can be divided into
Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)
Motors
Rail Tractions
Wind Turbines
Photovoltaic Equipment
There are 15 Chapters to deeply display the global Power Module Packaging market.
Chapter 1, to describe Power Module Packaging Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Power Module Packaging, with sales, revenue, and price of Power Module Packaging, in 2016 and 2017;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Power Module Packaging, for each region, from 2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;
Chapter 12, Power Module Packaging market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe Power Module Packaging sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source
Scope of the Report:
This report focuses on the Power Module Packaging in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
The market growth is driven by reduction in wastage of energy, use of efficient distributed cooling schemes, reduction in footprint, and consequent increase in power density.
The worldwide market for Power Module Packaging is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx million US$ in 2017, according to a new study.
Market Segment by Manufacturers, this report covers
Texas Instruments Incorporated
Star Automations
DyDac Controls
SEMIKRON
IXYS Corporation
Infineon Technologies AG
Mitsubishi Electric Corporation
Fuji Electric Co. Ltd.
Sanken Electric Co., Ltd.
SanRex Corporation
Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
GaN Module
SiC Module
FET Module
IGBT Module
Thyristors
Market Segment by Applications, can be divided into
Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)
Motors
Rail Tractions
Wind Turbines
Photovoltaic Equipment
There are 15 Chapters to deeply display the global Power Module Packaging market.
Chapter 1, to describe Power Module Packaging Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Power Module Packaging, with sales, revenue, and price of Power Module Packaging, in 2016 and 2017;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Power Module Packaging, for each region, from 2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;
Chapter 12, Power Module Packaging market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe Power Module Packaging sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source
Frequently Asked Questions
This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
- By product type
- By End User/Applications
- By Technology
- By Region
The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
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