Global Power Module Packaging Market Professional Survey Report 2019
A power electronic module or power module acts as a physical container for the storage of several power components, usually power semiconductor devices.
The market growth is driven by reduction in wastage of energy, use of efficient distributed cooling schemes, reduction in footprint, and consequent increase in power density.
The global Power Module Packaging market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Power Module Packaging volume and value at global level, regional level and company level. From a global perspective, this report represents overall Power Module Packaging market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Power Module Packaging in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Power Module Packaging manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.
The following manufacturers are covered:
Texas Instruments Incorporated
Star Automations
DyDac Controls
SEMIKRON
IXYS Corporation
Infineon Technologies AG
Mitsubishi Electric Corporation
Fuji Electric Co. Ltd.
Sanken Electric Co., Ltd.
SanRex Corporation
Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India
Segment by Type
GaN Module
SiC Module
FET Module
IGBT Module
Thyristors
Segment by Application
Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)
Motors
Rail Tractions
Wind Turbines
Photovoltaic Equipment
The market growth is driven by reduction in wastage of energy, use of efficient distributed cooling schemes, reduction in footprint, and consequent increase in power density.
The global Power Module Packaging market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Power Module Packaging volume and value at global level, regional level and company level. From a global perspective, this report represents overall Power Module Packaging market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Power Module Packaging in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Power Module Packaging manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.
The following manufacturers are covered:
Texas Instruments Incorporated
Star Automations
DyDac Controls
SEMIKRON
IXYS Corporation
Infineon Technologies AG
Mitsubishi Electric Corporation
Fuji Electric Co. Ltd.
Sanken Electric Co., Ltd.
SanRex Corporation
Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India
Segment by Type
GaN Module
SiC Module
FET Module
IGBT Module
Thyristors
Segment by Application
Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)
Motors
Rail Tractions
Wind Turbines
Photovoltaic Equipment
Frequently Asked Questions
This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
- By product type
- By End User/Applications
- By Technology
- By Region
The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
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