Global Plating for Microelectronics Market by Manufacturers, Countries, Type and Application, Forecast to 2023

Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.



Scope of the Report:

This report focuses on the Plating for Microelectronics in global market, especially in North America, Europe, Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, types and applications.

Market Segment by Manufacturers, this report covers

DOW

Mitsubishi Materials Corporation

Heraeus

XiLong Scientific

Atotech

Yamato Denki

Meltex

Ishihara Chemical

Raschig GmbH

Japan Pure Chemical

Coatech

MAGNETO special anodes

Vopelius Chemie AG

Moses Lake Industries

JCU International



Market Segment by Regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia and Italy)

Asia-Pacific (China, Japan, Korea, India and Southeast Asia)

South America (Brazil, Argentina, Colombia)

Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)



Market Segment by Type, covers

Electroplating

Electroless

Immersion



Market Segment by Applications, can be divided into

Gold

Zinc

Nickel

Bronze

Tin

Copper

Others



There are 15 Chapters to deeply display the global Plating for Microelectronics market.



Chapter 1, to describe Plating for Microelectronics Introduction, product scope, market overview, market opportunities, market risk, market driving force;



Chapter 2, to analyze the top manufacturers of Plating for Microelectronics, with sales, revenue, and price of Plating for Microelectronics, in 2016 and 2017;



Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;



Chapter 4, to show the global market by regions, with sales, revenue and market share of Plating for Microelectronics, for each region, from 2013 to 2018;



Chapter 5, 6, 7, 8 and 9, to analyze the key regions, with sales, revenue and market share by key countries in these regions;



Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;



Chapter 12, Plating for Microelectronics market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;



Chapter 13, 14 and 15, to describe Plating for Microelectronics sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source

Frequently Asked Questions



This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.

  • By product type
  • By End User/Applications
  • By Technology
  • By Region

The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.

Please Select a Format

market Reports market Reports