Global Low Temperature Co-fired Ceramic (LTCC) Market Study 2016-2026, by Segment (LTCC Components, LTCC Substrates, … …), by Market (Consumer Electronics, Aerospace & Military, … …), by Company (Murata(JP), Kyocera(JP), … …)
Summary
LTCC is a type of multilayer ceramic substrate that made by lower temperature (usually from 850 to 900℃) firing process than general ceramic firing process by adding glass to alumina. It makes it possible to use low resistive conductor as conductor patterns in. In this report, we research and analyze the devices which made by the LTCC technology, mainly include three categories of devices, LTCC components, LTCC substrates and LTCC modules. The LTCC components include LC filters, directional coupler, power splitter and antenna etc. The LTCC substrates include Bluetooth substrates and mobile front-end module substrates etc. And the LTCC modules include phone antenna modules, Bluetooth modules and power amplifier modules etc.
The global Low Temperature Co-fired Ceramic (LTCC) market will reach Volume Million USD in 2019 and with a CAGR xx% between 2020-2026.
LTCC Components
LTCC Substrates
LTCC Module
Demand Coverage (Market Size & Forecast, Consumer Distribution):
Consumer Electronics
Aerospace & Military
Automobile Electronics
Murata(JP)
Kyocera(JP)
TDK(JP)
Taiyo Yuden(JP)
KOA Corporation(JP)
Yokowo(JP)
Hitachi Metals(JP)
NIKKO(JP)
Soshin Electric(JP)
Bosch(DE)
IMST GmbH(DE)
MST(DE)
Via Electronic(DE)
Adamant(JP)
API Technologies(BE)
Selmic(FL)
VTT(FL)
American Technical Ceramics(US)
NEO Tech(US)
NTK Technologies(US)
Northrop Grumman(US)
Samsung Electro-Mechanics(KR)
PILKOR CND(KR)
ACX Corp(TW)
Yageo(TW)
Walsin Technology(TW)
Darfon Materials(TW)
Elit Fine Ceramics(TW)
Sunlord(CN)
CETC 43rd Institute(CN)
CNIGC 214th Institute(CN)
ChengDian Electronic(CN)
Microgate(CN)
Fenghua Advanced Technology(CN)
North America
Europe
Asia-Pacific
South America
Middle East & Africa
LTCC is a type of multilayer ceramic substrate that made by lower temperature (usually from 850 to 900℃) firing process than general ceramic firing process by adding glass to alumina. It makes it possible to use low resistive conductor as conductor patterns in. In this report, we research and analyze the devices which made by the LTCC technology, mainly include three categories of devices, LTCC components, LTCC substrates and LTCC modules. The LTCC components include LC filters, directional coupler, power splitter and antenna etc. The LTCC substrates include Bluetooth substrates and mobile front-end module substrates etc. And the LTCC modules include phone antenna modules, Bluetooth modules and power amplifier modules etc.
The global Low Temperature Co-fired Ceramic (LTCC) market will reach Volume Million USD in 2019 and with a CAGR xx% between 2020-2026.
Product Type Coverage (Market Size & Forecast, Major Company of Product Type etc.):
LTCC Components
LTCC Substrates
LTCC Module
Demand Coverage (Market Size & Forecast, Consumer Distribution):
Consumer Electronics
Aerospace & Military
Automobile Electronics
Company Coverage (Sales data, Main Products & Services etc.):
Murata(JP)
Kyocera(JP)
TDK(JP)
Taiyo Yuden(JP)
KOA Corporation(JP)
Yokowo(JP)
Hitachi Metals(JP)
NIKKO(JP)
Soshin Electric(JP)
Bosch(DE)
IMST GmbH(DE)
MST(DE)
Via Electronic(DE)
Adamant(JP)
API Technologies(BE)
Selmic(FL)
VTT(FL)
American Technical Ceramics(US)
NEO Tech(US)
NTK Technologies(US)
Northrop Grumman(US)
Samsung Electro-Mechanics(KR)
PILKOR CND(KR)
ACX Corp(TW)
Yageo(TW)
Walsin Technology(TW)
Darfon Materials(TW)
Elit Fine Ceramics(TW)
Sunlord(CN)
CETC 43rd Institute(CN)
CNIGC 214th Institute(CN)
ChengDian Electronic(CN)
Microgate(CN)
Fenghua Advanced Technology(CN)
Major Region
MarketNorth America
Europe
Asia-Pacific
South America
Middle East & Africa
Frequently Asked Questions
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