Global Electronic Packaging Materials Market Insights, Forecast to 2025

This report studies the Electronic Packaging Materials market.

Electronic packaging materials are used to carry electronic components and their interconnection, Function as mechanical support, seal environmental protection, heat dissipation of electronic components and so on. Electronic packaging materials have good electrical insulation, it is the sealing material of an integrated circuit.

Electronic packaging refers to the enclosure for integrated circuit (IC) chips, passive devices, the fabrication of circuit cards and the production of a final product or system. Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
In 2017, Global Electronic Packaging Materials total market size was 4885.6 Million USD, with a steady growth in recent years, according to QYR analysis, the market is expected to reach 6104.9 Million USD by the end of 2023. One of the salient features of Electronic Packaging Materials market is the cooperation with downstream Semiconductor & IC and PCB manufactures, especially for large companies in this industry.
Geographically, the consumption market is leading by Greater China and United States, Europe and Japan. In terms of year 2017, Greater China holds the largest market share, with about 1975.5 Million USD sales revenue, followed by United States, with about 14.76% market share in 2017. China will keep playing important role in Global market.
The Electronic Packaging Materials market was valued at 4890 Million US$ in 2018 and is projected to reach 6110 Million US$ by 2025, at a CAGR of 2.8% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Electronic Packaging Materials.

This report presents the worldwide Electronic Packaging Materials market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

The following manufacturers are covered in this report:
DuPont
Evonik
EPM
Mitsubishi Chemical
Sumitomo Chemical
Mitsui High-tec
Tanaka
Shinko Electric Industries
Panasonic
Hitachi Chemical
Kyocera Chemical
Gore
BASF
Henkel
AMETEK Electronic
Toray
Maruwa
Leatec Fine Ceramics
NCI
Chaozhou Three-Circle
Nippon Micrometal
Toppan
Dai Nippon Printing
Possehl
Ningbo Kangqiang

Electronic Packaging Materials Breakdown Data by Type
Metal Packages
Plastic Packages
Ceramic Packages
Electronic Packaging Materials Breakdown Data by Application
Semiconductor & IC
PCB
Others

Electronic Packaging Materials Production by Region
United States
Europe
China
Japan
South Korea
Other Regions

Electronic Packaging Materials Consumption by Region
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Malaysia
Philippines
Thailand
Vietnam
Europe
Germany
France
UK
Italy
Russia
Rest of Europe
Central & South America
Brazil
Rest of South America
Middle East & Africa
GCC Countries
Turkey
Egypt
South Africa
Rest of Middle East & Africa

The study objectives are:
To analyze and research the global Electronic Packaging Materials status and future forecast，involving, production, revenue, consumption, historical and forecast.
To present the key Electronic Packaging Materials manufacturers, production, revenue, market share, and recent development.
To split the breakdown data by regions, type, manufacturers and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

In this study, the years considered to estimate the market size of Electronic Packaging Materials :
History Year: 2014 - 2018
Base Year: 2018
Estimated Year: 2019
Forecast Year: 2019 - 2025

This report includes the estimation of market size for value (million USD) and volume (K Units). Both top-down and bottom-up approaches have been used to estimate and validate the market size of Electronic Packaging Materials market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.

For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

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