Global Die Attach Materials Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024
- SKU ID : GIR-GIR1901240193 13619961
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- Publishing Date: 06-Feb-2019
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- Region: Global
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- No. of pages: 136
Die-attach are the term reserved for processes where the face of a die is attached to a substrate by a single joint.
Scope of the Report:
For power and high-power applications, die-attach products are made of high-lead solder alloys, which fulfill the requirements of high melting temperature and adequate thermo-mechanical properties, to ensure lifetime package reliability. However, die-attach processes parameters must be adapted for each application to achieve optimal results.
In global market, the production of Die Attach Materials increases from 21165 MT in 2012 to 26131MT in 2016, at a CAGR of 5.41%. In 2016, the global Die Attach Materials market is led by China, capturing about 43.63% of global Die Attach Materials production. Europe is the second-largest region-wise market with 6.51% global production share.
At present, the major manufacturers of Die Attach Materials are SMIC, Henkel, Shenzhen Vital New Material, Indium, Alpha Assembly Solutions, TONGFANG TECH, Umicore. SMIC is the world leader, holding 7.34% production market share in 2016.
In application, Die Attach Materials downstream is wide and recently Die Attach Materials has acquired increasing significance in various fields of Consumer Electronics, Automotive, Medical, Telecommunications and others. Globally, the Die Attach Materials market is mainly driven by growing demand for Consumer Electronics which accounts for nearly 79.19% of total downstream consumption of Die Attach Materials in global.
In the future, global market is expected to witness significant growth on account of rising applications, so in the next few years, Die Attach Materials production will show a trend of steady growth. In 2022 the production of Die Attach Materials is estimated to be 35809 MT.
The worldwide market for Die Attach Materials is expected to grow at a CAGR of roughly 5.6% over the next five years, will reach 1070 million US$ in 2024, from 770 million US$ in 2019, according to a new study.
This report focuses on the Die Attach Materials in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
SMIC
Henkel
Shenzhen Vital New Material
Indium
Alpha Assembly Solutions
TONGFANG TECH
Umicore
Heraeu
AIM
TAMURA RADIO
Kyocera
Shanghai Jinji
Palomar Technologies
Nordson EFD
Dow Corning Corporation
Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
Die Attach Paste
Die Attach Wire
Others
Market Segment by Applications, can be divided into
Consumer Electronics
Automotive
Medical
Telecommunications
Others
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Die Attach Materials product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Die Attach Materials, with price, sales, revenue and global market share of Die Attach Materials in 2017 and 2018.
Chapter 3, the Die Attach Materials competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Die Attach Materials breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Die Attach Materials market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Die Attach Materials sales channel, distributors, customers, research findings and conclusion, appendix and data source.
Scope of the Report:
For power and high-power applications, die-attach products are made of high-lead solder alloys, which fulfill the requirements of high melting temperature and adequate thermo-mechanical properties, to ensure lifetime package reliability. However, die-attach processes parameters must be adapted for each application to achieve optimal results.
In global market, the production of Die Attach Materials increases from 21165 MT in 2012 to 26131MT in 2016, at a CAGR of 5.41%. In 2016, the global Die Attach Materials market is led by China, capturing about 43.63% of global Die Attach Materials production. Europe is the second-largest region-wise market with 6.51% global production share.
At present, the major manufacturers of Die Attach Materials are SMIC, Henkel, Shenzhen Vital New Material, Indium, Alpha Assembly Solutions, TONGFANG TECH, Umicore. SMIC is the world leader, holding 7.34% production market share in 2016.
In application, Die Attach Materials downstream is wide and recently Die Attach Materials has acquired increasing significance in various fields of Consumer Electronics, Automotive, Medical, Telecommunications and others. Globally, the Die Attach Materials market is mainly driven by growing demand for Consumer Electronics which accounts for nearly 79.19% of total downstream consumption of Die Attach Materials in global.
In the future, global market is expected to witness significant growth on account of rising applications, so in the next few years, Die Attach Materials production will show a trend of steady growth. In 2022 the production of Die Attach Materials is estimated to be 35809 MT.
The worldwide market for Die Attach Materials is expected to grow at a CAGR of roughly 5.6% over the next five years, will reach 1070 million US$ in 2024, from 770 million US$ in 2019, according to a new study.
This report focuses on the Die Attach Materials in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
SMIC
Henkel
Shenzhen Vital New Material
Indium
Alpha Assembly Solutions
TONGFANG TECH
Umicore
Heraeu
AIM
TAMURA RADIO
Kyocera
Shanghai Jinji
Palomar Technologies
Nordson EFD
Dow Corning Corporation
Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
Die Attach Paste
Die Attach Wire
Others
Market Segment by Applications, can be divided into
Consumer Electronics
Automotive
Medical
Telecommunications
Others
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Die Attach Materials product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Die Attach Materials, with price, sales, revenue and global market share of Die Attach Materials in 2017 and 2018.
Chapter 3, the Die Attach Materials competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Die Attach Materials breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Die Attach Materials market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Die Attach Materials sales channel, distributors, customers, research findings and conclusion, appendix and data source.
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