Global 3D TSV and 2.5D Market - Segmented by Technology (DDR2, DDR3, and DDR4), Application (Mobile Devices, Computing Devices, and Networking Devices), and Geography - Growth, Trends, and Forecast (2022 - 2030)
The global 3D TSV and 2.5D market is expected to project a growth rate of 35.2% during the forecast period (2018 - 2023).
Connected devices and other wireless technologies like Wi-Fi and Bluetooth, are some of the features integrated in smart gadgets and devices for communicating with other devices. Several integrated circuits need to be incorporated in a single chip module for reducing the board space and cost. Miniaturization of electronic devices and the rapid growth of smartphones and tablets are also expected to influence the demand of the market.
Expanding Market for Smartphones, Tablets, and Gaming Devices
Advanced transformations of the consumer electronics require manufacturers to improve the offerings in terms of design, processing power, power consumption, and user interface, frequently. Such upgrades in consumer electronics will require the use of robust technology. 3D TSV is the core of integrated chip packaging on a nanometer scale ensuring robust hardware for technology. Shipments of smartphones is expected to reach 2 billion units by 2020, majorly due to the availability of low-cost smartphones in developing nations, such as China and India.
Asia-Pacific to Occupy a Significant Market Share
Countries, like China, Japan, South Korea, Indonesia, Singapore, and Australia have recorded high levels of manufacturing in the consumer electronics, automotive, and transportation sectors, which a key source of demand for 3D TSV and 2.5D market in the region. The rising popularity of smartphones and demand for new memory technologies has increased the growth of computationally intensive consumer electronics, thereby creating a wide range of opportunities in this region. Asia-Pacific is one of the most active manufacturing hubs in the world.
Key Developments in the Market
• March 2017 - Advanced Semiconductor Engineering, Inc., and Cadence Design Systems, Inc., announced they have collaborated to release a System-in-Package (SiP) EDA solution, that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages.
Major Players - TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, SAMSUNG ELECTRONICS CO. LTD, TOSHIBA CORP., PURE STORAGE INC., ADVANCED SEMICONDUCTOR ENGINEERING INC., AMKOR TECHNOLOGY, UNITED MICROELECTRONICS CORP., STMICROELECTRONICS NV, BROADCOM LTD, INTEL CORPORATION, JIANGSU CHANGING ELECTRONICS TECHNOLOGY CO. LTD, amongst others.
Reasons to Purchase this Report
• Impact of growing demand for smartphones and tablets.
• Analyzing various perspectives of the market with the help of Porter’s five forces analysis.
• Growth of various products such as - MEMS, Sensors, and Optpelectronics.
• Regional analysis of the market.
• Identify the latest developments, market shares, and strategies employed by the major market players.
• 3 months analyst support, along with the Market Estimate sheet (in excel).
Customization of the Report
• This report can be customized to meet your requirements. Please connect with our representative, who will ensure you get a report that suits your needs.
Connected devices and other wireless technologies like Wi-Fi and Bluetooth, are some of the features integrated in smart gadgets and devices for communicating with other devices. Several integrated circuits need to be incorporated in a single chip module for reducing the board space and cost. Miniaturization of electronic devices and the rapid growth of smartphones and tablets are also expected to influence the demand of the market.
Expanding Market for Smartphones, Tablets, and Gaming Devices
Advanced transformations of the consumer electronics require manufacturers to improve the offerings in terms of design, processing power, power consumption, and user interface, frequently. Such upgrades in consumer electronics will require the use of robust technology. 3D TSV is the core of integrated chip packaging on a nanometer scale ensuring robust hardware for technology. Shipments of smartphones is expected to reach 2 billion units by 2020, majorly due to the availability of low-cost smartphones in developing nations, such as China and India.
Asia-Pacific to Occupy a Significant Market Share
Countries, like China, Japan, South Korea, Indonesia, Singapore, and Australia have recorded high levels of manufacturing in the consumer electronics, automotive, and transportation sectors, which a key source of demand for 3D TSV and 2.5D market in the region. The rising popularity of smartphones and demand for new memory technologies has increased the growth of computationally intensive consumer electronics, thereby creating a wide range of opportunities in this region. Asia-Pacific is one of the most active manufacturing hubs in the world.
Key Developments in the Market
• March 2017 - Advanced Semiconductor Engineering, Inc., and Cadence Design Systems, Inc., announced they have collaborated to release a System-in-Package (SiP) EDA solution, that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages.
Major Players - TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, SAMSUNG ELECTRONICS CO. LTD, TOSHIBA CORP., PURE STORAGE INC., ADVANCED SEMICONDUCTOR ENGINEERING INC., AMKOR TECHNOLOGY, UNITED MICROELECTRONICS CORP., STMICROELECTRONICS NV, BROADCOM LTD, INTEL CORPORATION, JIANGSU CHANGING ELECTRONICS TECHNOLOGY CO. LTD, amongst others.
Reasons to Purchase this Report
• Impact of growing demand for smartphones and tablets.
• Analyzing various perspectives of the market with the help of Porter’s five forces analysis.
• Growth of various products such as - MEMS, Sensors, and Optpelectronics.
• Regional analysis of the market.
• Identify the latest developments, market shares, and strategies employed by the major market players.
• 3 months analyst support, along with the Market Estimate sheet (in excel).
Customization of the Report
• This report can be customized to meet your requirements. Please connect with our representative, who will ensure you get a report that suits your needs.
Frequently Asked Questions
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