Global 3D Semiconductor Packaging Market Size, Status and Forecast 2020-2026

3D packaging refers to 3D integration schemes that rely on traditional methods of interconnect at the package level such as wire bonding and flip chip to achieve vertical stacks. Examples of 3D packages include package-on-package (PoP) where individual die are packaged, and the packages are stacked and interconnected with wire bonds or flip chip processes; and 3D wafer-level packaging (3D WLP) that uses redistribution layers (RDL) and bumping processes to form interconnects.
Consumer Electronics industry contributed over 54% of the overall 3D semiconductor packaging market in 2018. Increase in penetration of 3D semiconductor packaged chips in devices such as smartphones, laptops, digital cameras, and others drives the growth in market as these chips are majorly used in camera and memory. However, IT & telecom is expected to grow fastest at a CAGR of 17.82% during the forecast period, owing to increased investment by developing nations to increase connectivity and rise in number of wireless devices worldwide.
Market Analysis and Insights: Global 3D Semiconductor Packaging Market
In 2019, the global 3D Semiconductor Packaging market size was US$ 2075.8 million and it is expected to reach US$ 6226.6 million by the end of 2026, with a CAGR of 16.8% during 2021-2026.
Global 3D Semiconductor Packaging Scope and Market Size
3D Semiconductor Packaging market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global 3D Semiconductor Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application in terms of revenue and forecast for the period 2015-2026.
Segment by Type, the 3D Semiconductor Packaging market is segmented into 3D Wire Bonding, 3D TSV, 3D Fan Out, Others, etc.
Segment by Application, the 3D Semiconductor Packaging market is segmented into Consumer Electronics, Industrial, Automotive & Transport, IT & Telecommunication, Others, etc.
Regional and Country-level Analysis
The 3D Semiconductor Packaging market is analysed and market size information is provided by regions (countries).
The key regions covered in the 3D Semiconductor Packaging market report are United States, Europe, China, Taiwan, Korea and Japan, etc.
The report includes country-wise and region-wise market size for the period 2015-2026. It also includes market size and forecast by Type, and by Application segment in terms of revenue for the period 2015-2026.

Competitive Landscape

and 3D Semiconductor Packaging Market Share Analysis
3D Semiconductor Packaging market competitive landscape provides details and data information by vendors. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on revenue (global and regional level) by player for the period 2015-2020. Details included are company description, major business, company total revenue and the revenue generated in 3D Semiconductor Packaging business, the date to enter into the 3D Semiconductor Packaging market, 3D Semiconductor Packaging product introduction, recent developments, etc.
The major vendors include lASE, Amkor, Intel, Samsung, AT&S, Toshiba, JCET, Qualcomm, IBM, SK Hynix, UTAC, TSMC, China Wafer Level CSP, Interconnect Systems, etc.

This report focuses on the global 3D Semiconductor Packaging status, future forecast, growth opportunity, key market and key players. The study objectives are to present the 3D Semiconductor Packaging development in United States, Europe, China, Taiwan, Korea and Japan.

The key players covered in this study

lASE
Amkor
Intel
Samsung
AT&S
Toshiba
JCET
Qualcomm
IBM
SK Hynix
UTAC
TSMC
China Wafer Level CSP
Interconnect Systems

Market segment by Type, the product can be split into

3D Wire Bonding
3D TSV
3D Fan Out
Others
3D Wire Bonding Occupy the largest market share segment reached 44%

Market segment by Application, split into

Consumer Electronics
Industrial
Automotive & Transport
IT & Telecommunication
Others
Consumer Electronics has the largest market share segment with 54% and the fastest growth

Market segment by Regions/Countries, this report covers

United States
Europe
China
Taiwan
Korea
Japan

The study objectives of this report are:

To analyze global 3D Semiconductor Packaging status, future forecast, growth opportunity, key market and key players.
To present the 3D Semiconductor Packaging development in United States, Europe, China, Taiwan, Korea and Japan.
To strategically profile the key players and comprehensively analyze their development plan and strategies.
To define, describe and forecast the market by type, market and key regions.

In this study, the years considered to estimate the market size of 3D Semiconductor Packaging are as follows:
History Year: 2015-2019

Base Year:

2019

Estimated Year:

2020
Forecast Year 2020 to 2026
For the data information by region, company, type and application, 2019 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Frequently Asked Questions