The global Trusted Platform Module (TPM) market was valued at million US$ in 2018 and will reach million US$ by the end of 2025, growing at a CAGR of during 2019-2025.
This report focuses on Trusted Platform Module (TPM) volume and value at global level, regional level and company level. From a global perspective, this report represents overall Trusted Platform Module (TPM) market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Trusted Platform Module (TPM) in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Trusted Platform Module (TPM) manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

The following manufacturers are covered:
AMD (USA)
HP (USA)
IBM (USA)
Infineon (Germany)
Intel (US)
Lenovo (China)
Microsoft (USA)
Nationz (China)
Nuvoton (China)
Samsung (Korea)
Security Innovation, Inc (USA)
SK hynix (Korea)

Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India

Segment by Type
TPM 1.2
TPM 2.0

Segment by Application
Mobile Security
Automotive
Banking, Transport, Pay TV & ID
Wearable
Security in IoT Connectivity
Others