Thermosetting Resin Moulding Materials for Electronics resins are used for the manufacturing of printed circuit boards, prepregs and copper clad laminates, amongst others.
With rise in demand for lighter, shorter, thermally stable and reliable circuit boards, Thermosetting Resin Moulding Materials for Electronics are gaining prominence in the digital world. Owing to good adhesion, high electrical insulation and mechanical and thermal stability properties of Thermosetting Resin Moulding Materials for Electronics resins, their use has grown significantly over the past decade.

The global Thermosetting Moulding Materials for Electronics market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Thermosetting Moulding Materials for Electronics volume and value at global level, regional level and company level. From a global perspective, this report represents overall Thermosetting Moulding Materials for Electronics market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Thermosetting Moulding Materials for Electronics in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Thermosetting Moulding Materials for Electronics manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

The following manufacturers are covered:
BASF
Cosmic Plastics
Eastman
Hitachi
Huntsman
Evonik
Momentive
Kolon industries
Plastics Engineering Company (Plenco)
KYOCERA

Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India

Segment by Type
Epoxy
Polyester
Polyurethane
Polyimide
Bakelite
Formaldehyde
Others

Segment by Application
Automotive
Consumer Electronics
Aerospace
Other