The properties of thermoset molding compounds such as high-heat resistance, dimensional stability, and electrical insulation capability makes them ideal material for several end-use applications. These are highly used in electrical & electronics applications owing to its toughness, resistance to several environmental factors, stability, and flame resistance.

The global Thermoset Molding Compound market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Thermoset Molding Compound volume and value at global level, regional level and company level. From a global perspective, this report represents overall Thermoset Molding Compound market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.

The following manufacturers are covered:
Hitachi Chemical Company
Cosmic Plastics
Chang Chun Plastics
Saudi Basic Industries Corporation
Nan Ya Plastics Corporation
Allnex Belgium
Georgia-Pacific Chemicals
Jiangsu Tianxin Chemical
Mitsui Chemicals
Chemiplastica

Segment by Regions
North America
Europe
China
Japan

Segment by Type
Phenolic Resin
Epoxy Resin
Polyester Resin
Urea Formaldehyde Resin
Melamine Formaldehyde Resin
Others

Segment by Application
Automotive
Aerospace
Electrical & Electronics
Others