Global Thermal Interface Pads and Material Market Professional Survey Report 2019
SKU ID :QYR-14576343 | Published Date: 08-Oct-2019 | No. of pages: 102Description
Thermal interface pads & material consists of various products which can be used to transfer heat from electronic components through heat sinks. The pads & materials have a wide range of applications in various industries such as consumer electronics, telecom, power supply units, aerospace and among others.
Increasing demand for effective thermal management for equipment in computer and telecom industry along with their adoption in designing LED displays is a key factor driving the growth of the market. The demand for energy efficient devices which can reduce the energy loss will also foster the growth of thermal interface pads and material market. However, high cost of devices equipped with thermal interface pads and materials is a key restraining factor for the growth of market.
The global Thermal Interface Pads and Material market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Thermal Interface Pads and Material volume and value at global level, regional level and company level. From a global perspective, this report represents overall Thermal Interface Pads and Material market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Thermal Interface Pads and Material in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Thermal Interface Pads and Material manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.
The following manufacturers are covered:
Honeywell International
The Bergquist Company
DOW Corning
3M
Henkel
Fujipoly
GrafTech International Holdings
Laird Technologies
Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India
Segment by Type
Thermal Grease
Phase Change Material
Thermal Pads
Segment by Application
Power Supply Units
Consumer Electronics
Telecom Equipment
Others
Increasing demand for effective thermal management for equipment in computer and telecom industry along with their adoption in designing LED displays is a key factor driving the growth of the market. The demand for energy efficient devices which can reduce the energy loss will also foster the growth of thermal interface pads and material market. However, high cost of devices equipped with thermal interface pads and materials is a key restraining factor for the growth of market.
The global Thermal Interface Pads and Material market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Thermal Interface Pads and Material volume and value at global level, regional level and company level. From a global perspective, this report represents overall Thermal Interface Pads and Material market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Thermal Interface Pads and Material in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Thermal Interface Pads and Material manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.
The following manufacturers are covered:
Honeywell International
The Bergquist Company
DOW Corning
3M
Henkel
Fujipoly
GrafTech International Holdings
Laird Technologies
Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India
Segment by Type
Thermal Grease
Phase Change Material
Thermal Pads
Segment by Application
Power Supply Units
Consumer Electronics
Telecom Equipment
Others
TOC
Tables & Figures
Companies
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