Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K). The sputtered ions (typically only a small fraction of the ejected particles are ionized — on the order of 1 percent) can ballistically fly from the target in straight lines and impact energetically on the substrates or vacuum chamber (causing resputtering). Alternatively, at higher gas pressures, the ions collide with the gas atoms that act as a moderator and move diffusively, reaching the substrates or vacuum chamber wall and condensing after undergoing a random walk. The entire range from high-energy ballistic impact to low-energy thermalized motion is accessible by changing the background gas pressure. The sputtering gas is often an inert gas such as argon. For efficient momentum transfer, the atomic weight of the sputtering gas should be close to the atomic weight of the target, so for sputtering light elements neon is preferable, while for heavy elements krypton or xenon are used. Reactive gases can also be used to sputter compounds. The compound can be formed on the target surface, in-flight or on the substrate depending on the process parameters. The availability of many parameters that control sputter deposition make it a complex process, but also allow experts a large degree of control over the growth and microstructure of the film.

The global Sputter Coater market was valued at 560 million US$ in 2018 and will reach 910 million US$ by the end of 2025, growing at a CAGR of 6.2% during 2019-2025.
This report focuses on Sputter Coater volume and value at global level, regional level and company level. From a global perspective, this report represents overall Sputter Coater market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Sputter Coater in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Sputter Coater manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

The following manufacturers are covered:
ULVAC (Japan)
Quorum Technologies (UK)
Buhler (Switzerland)
Cressington Scientific Instruments (UK)
Hitachi High-Technologies Corporation (Japan)
Oxford Instruments (UK)
Semicore Equipment (US)
PLASSYS Bestek (France)
PVD Products (US)
Denton Vacuum (US)

Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India

Segment by Type
Metal
Glass
Semiconductor
Others (Biological and Plastics)

Segment by Application
Automotive
Electronics & Semiconductor
Institutes
Others (Hardware, FMCG, Construction, and Medical)
On the Basis of Region: