Summary
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
The global Solder Ball market will reach Volume Million USD in 2019 and with a CAGR xx% between 2020-2026.

Product Type Coverage (Market Size & Forecast, Major Company of Product Type etc.):

Lead Solder Ball
Lead Free Solder Ball
Demand Coverage (Market Size & Forecast, Consumer Distribution):
BGA
CSP & WLCSP
Flip-Chip & Others

Company Coverage (Sales data, Main Products & Services etc.):

Senju Metal
DS HiMetal
MKE
YCTC
Nippon Micrometal
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology

Major Region

Market
North America
Europe
Asia-Pacific
South America
Middle East & Africa