Global Power Module Packaging Market Study 2016-2026, by Segment (GaN Module, FET Module, … …), by Market (Wind Turbines, Rail Tractions, … …), by Company (IXYS Corporation, Star Automations, … …)
SKU ID :99ST-14632420 | Published Date: 28-Oct-2019 | No. of pages: 58Description
Summary
The global Power Module Packaging market will reach Volume Million USD in 2019 and with a CAGR xx% between 2020-2026.
GaN Module
FET Module
IGBT Module
SiC Module
Demand Coverage (Market Size & Forecast, Consumer Distribution):
Wind Turbines
Rail Tractions
Motors
Electric Vehicles
Photovoltaic Equipments
Others
IXYS Corporation
Star Automations
DyDac Controls
SEMIKRON
Mitsubishi Electric Corporation
Texas Instruments Incorporated
Sanken Electric Co., Ltd.
Fuji Electric Co. Ltd.
Infineon Technologies AG
SanRex Corporation
North America
Europe
Asia-Pacific
South America
Middle East & Africa
The global Power Module Packaging market will reach Volume Million USD in 2019 and with a CAGR xx% between 2020-2026.
Product Type Coverage (Market Size & Forecast, Major Company of Product Type etc.):
GaN Module
FET Module
IGBT Module
SiC Module
Demand Coverage (Market Size & Forecast, Consumer Distribution):
Wind Turbines
Rail Tractions
Motors
Electric Vehicles
Photovoltaic Equipments
Others
Company Coverage (Sales data, Main Products & Services etc.):
IXYS Corporation
Star Automations
DyDac Controls
SEMIKRON
Mitsubishi Electric Corporation
Texas Instruments Incorporated
Sanken Electric Co., Ltd.
Fuji Electric Co. Ltd.
Infineon Technologies AG
SanRex Corporation
Major Region
MarketNorth America
Europe
Asia-Pacific
South America
Middle East & Africa
TOC
Tables & Figures
Companies
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