A power electronic module or power module acts as a physical container for the storage of several power components, usually power semiconductor devices.
The market growth is driven by reduction in wastage of energy, use of efficient distributed cooling schemes, reduction in footprint, and consequent increase in power density. 

The global Power Module Packaging market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Power Module Packaging volume and value at global level, regional level and company level. From a global perspective, this report represents overall Power Module Packaging market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Power Module Packaging in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Power Module Packaging manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

The following manufacturers are covered:
Texas Instruments Incorporated
Star Automations
DyDac Controls
SEMIKRON
IXYS Corporation
Infineon Technologies AG
Mitsubishi Electric Corporation
Fuji Electric Co. Ltd.
Sanken Electric Co., Ltd.
SanRex Corporation

Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India

Segment by Type
GaN Module
SiC Module
FET Module
IGBT Module
Thyristors

Segment by Application
Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)
Motors
Rail Tractions
Wind Turbines
Photovoltaic Equipment