Encapsulation is generally adopted in packaging of lamp-LEDs. The encapsulation procedure is to pour liquid epoxy into the LED moulding chamber first, and then insert the LED bracket that has undergone the press welding, then put the mould into the oven, and the LED gets shaped when the epoxy solidifies.

The global LED Encapsulation market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on LED Encapsulation volume and value at global level, regional level and company level. From a global perspective, this report represents overall LED Encapsulation market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of LED Encapsulation in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their LED Encapsulation manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

The following manufacturers are covered:
Dow
Nusil
H.B. Fuller
Shin-Etsu Chemical
Henkel
KYOCERA
Hitachi Chemical
Panasonic
Epic Resins
Intertronics

Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India

Segment by Type
Epoxy
Silicone
Polyurethane

Segment by Application
Consumer electronics
Automotive
Telecommunication
Medical