The Laser Direct Imaging (LDI) Solutions offer auto focus capabilities so that the system can handle different thicknesses of material and rapid job change-overs without expensive tooling.
Using LDI to create the circuit traces gives the PCB manufacturers a lot of advantages, most of them pertaining to weaknesses of using a Photo-tool. Eliminating the need of a Photo-tool removes alignment issues, light refraction issues, and those imperfections related to environmental variations.

The global Laser Direct Imaging (LDI) Solutions market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Laser Direct Imaging (LDI) Solutions volume and value at global level, regional level and company level. From a global perspective, this report represents overall Laser Direct Imaging (LDI) Solutions market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Laser Direct Imaging (LDI) Solutions in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Laser Direct Imaging (LDI) Solutions manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

The following manufacturers are covered:
Orbotech
ORC Manufacturing
Fuji Film
SCREEN
Via Mechanics
Manz
Limata
Han's CNC
Aiscent
AdvanTools

Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India

Segment by Type
Polygon Mirror 365nm
DMD 405nm

Segment by Application
Standard and HDI PCB
Thick-Copper and Ceramic PCB
Oversized PCB
Solder Mask