Summary
IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate for IC packaging is as high as 35-55%.
This report describes the development of the industry by upstream & downstream, industry overall and development, key companies, as well as type segment & market application and so on, and makes a scientific prediction for the development industry prospects on the basis of analysis, finally, analyzes opportunities for investment in the industry at the end of the report.
Industry Chain
Raw Materials
Cost
Technology
Consumer Preference
Industry Overall:
History
Development & Trend
Market Competition
Trade Overview
Policy
Region (North America, Europe, Asia-Pacific, South America, Middle East, Africa):
Regional Market
Production Development
Sales
Regional Trade
Regional Forecast
Company (Ibiden(JP), Shinko Electric Industries(JP), Kyocera(JP), Eastern(JP), Unimicron(TW), Unimicron(TW), Kinsus(TW), Nanya(TW), ASE(TW), Semco(KR), LG Innotek(KR), Simmtech(KR), Daeduck(KR), KCC(KR), Zhen Ding Technology(TW), AT&S (a Austrian company, has IC substrate factories in Chongqing, China), Shennan Circuit(CN), ACCESS(CN), Shenzhen Fastprint Circuit Tech(CN) etc.):
Company Profile
Product & Service
Business Operation Data
Market Share
Investment Analysis:
Market Features
Investment Opportunity
Investment Calculation