Snapshot
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature at optimal levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.
The global Heat Sinks market will reach xxx Million USD in 2017 and CAGR xx% 2011-2017. The report begins from overview of Industry Chain structure, and describes industry environment, then analyses market size and forecast of Heat Sinks by product, region and application, in addition, this report introduces market competition situation among the vendors and company profile, besides, market price analysis and value chain features are covered in this report.
Product Type Coverage (Market Size & Forecast, Major Company of Product Type etc.):
Aluminum heat sink
Copper heat sink
Copper aluminum heat sink
Company Coverage (Sales Revenue, Price, Gross Margin, Main Products etc.):
Molex
GE
TE Connectivity
Delta
Laird
Ohmite
Aavid Thermalloy
Sunon
Advanced Thermal Solutions
American Technical Ceramics
Apex Microtechnology
Comair Rotron
CUI
T-Global Technology
Wakefied-Vette
Application Coverage (Market Size & Forecast, Different Demand Market by Region, Main Consumer Profile etc.):
Automobile industry
Electronic industry
Others
Region Coverage (Regional Output, Demand & Forecast by Countries etc.):
North America
Europe
Asia-Pacific
South America
Middle East & Africa