Global Flip Chip Packages Market 2022-2028
SKU ID :TNV-12782517 | Published Date: 04-Sep-2018 | No. of pages: 123Description
About Flip Chip Packaging
Flip chip is a packaging technology that interconnects chips and package carriers or substrates with conductive bumps. The use of the technology in semiconductor chip packaging ensures a direct electrical connection of face-down electronic dies with organic or ceramic circuit boards using conductive bumps on the chip bond pads.
’s analysts forecast the global flip chip packages market to grow at a CAGR of 6.35% during the period 2018-2022.
Covered in this report
The report covers the present scenario and the growth prospects of the global flip chip packages market for 2018-2022. To calculate the market size, the report considers the sales of semiconductor devices based on flip chip packaging technology to end-user sectors including communication, computing and networking, industrial, and automotive.
The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA
's report, Global Flip Chip Packages Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
• Advanced Semiconductor Engineering
• Chipbond Technology
• Intel
• Siliconware Precision Industries
• Taiwan Semiconductor Manufacturing Company
Market driver
• Rise in use of 3D chip packaging
• For a full, detailed list, view our report
Market challenge
• Need for high initial capital investments
• For a full, detailed list, view our report
Market trend
• Growing number of OSAT companies in APAC
• For a full, detailed list, view our report
Key questions answered in this report
• What will the market size be in 2022 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.
Flip chip is a packaging technology that interconnects chips and package carriers or substrates with conductive bumps. The use of the technology in semiconductor chip packaging ensures a direct electrical connection of face-down electronic dies with organic or ceramic circuit boards using conductive bumps on the chip bond pads.
’s analysts forecast the global flip chip packages market to grow at a CAGR of 6.35% during the period 2018-2022.
Covered in this report
The report covers the present scenario and the growth prospects of the global flip chip packages market for 2018-2022. To calculate the market size, the report considers the sales of semiconductor devices based on flip chip packaging technology to end-user sectors including communication, computing and networking, industrial, and automotive.
The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA
's report, Global Flip Chip Packages Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
• Advanced Semiconductor Engineering
• Chipbond Technology
• Intel
• Siliconware Precision Industries
• Taiwan Semiconductor Manufacturing Company
Market driver
• Rise in use of 3D chip packaging
• For a full, detailed list, view our report
Market challenge
• Need for high initial capital investments
• For a full, detailed list, view our report
Market trend
• Growing number of OSAT companies in APAC
• For a full, detailed list, view our report
Key questions answered in this report
• What will the market size be in 2022 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.
TOC
Tables & Figures
Companies
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