Eutectic solders tend to have a bright and shiny appearance as compared to non-eutectic solders.  The physical and mechanical properties are also different for each solder alloy.
Lead-free solders used to replace tin-lead solder ideally have the same properties as tin-lead solder. Most lead-free solders are tin based and contain silver, copper, and other additives. The elements alloyed into lead-free solders help to modify the properties of pure tin to become more favorable for electronic applications.

The global Eutectic Solder market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Eutectic Solder volume and value at global level, regional level and company level. From a global perspective, this report represents overall Eutectic Solder market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Eutectic Solder in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Eutectic Solder manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

The following manufacturers are covered:
Kester
Kapp Alloy
Finetech
Fujitsu
Thompson Enamel
...

Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India

Segment by Type
Au-Sn
Au-Ge
Cu-Ag
Others

Segment by Application
SMT Assembly
Semiconductor Packaging