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Global Electronic Thermal Interface Materials Market Study 2016-2026, by Segment (Silicone Grease, Non-Silicone Grease), by Market (LED Lighting, Automotive Electronics, … …), by Company (Dow Corning Corporation (US), 3M Company (US), … …)

SKU ID :99ST-14578998 | Published Date: 07-Oct-2019 | No. of pages: 79
Summary

The global Electronic Thermal Interface Materials market will reach Volume Million USD in 2019 and with a CAGR xx% between 2020-2026.

Product Type Coverage (Market Size & Forecast, Major Company of Product Type etc.):


Silicone Grease
Non-Silicone Grease
Demand Coverage (Market Size & Forecast, Consumer Distribution):
LED Lighting
Automotive Electronics
Power Electronics
Telecommunication & IT
Others

Company Coverage (Sales data, Main Products & Services etc.):


Dow Corning Corporation (US)
3M Company (US)
Parker-Hannifin Corporation (US)
Wacker Chemie AG (Germany)
Henkel AG & Co. KGaA (Germany)
Lord Corporation (US)
Electrolube (UK)
Momentive Performance Materials Inc. (US)
Laird PLC (US)
Shin-Etsu MicroSi, Inc (US)
ACC Silicones
AOS Thermal Compounds
OMEGA Engineering Inc.
Polymatech Japan Co., Ltd.
Intertronics
Nusil Technology LLC
Microtech Components GmbH
Aremco Products Inc.
M.G. Chemicals
Novagard Solutions Inc.
Dupont
Kerafol Keramische Folien GmbH
Fujipoly
Wakefield-Vette, Inc.
Zalman Tech Co., Ltd.

Major Region

Market
North America
Europe
Asia-Pacific
South America
Middle East & Africa
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