Snapshot

Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.
The global Electronic Potting & Encapsulating market size is estimated at xxx million USD with a CAGR xx% from 2015-2019 and is expected to reach xxx Million USD in 2020 with a CAGR xx% from 2020 to 2025. The report begins from overview of Industry Chain structure, and describes industry environment, then analyses market size and forecast of Electronic Potting & Encapsulating by product, region and application, in addition, this report introduces market competition situation among the vendors and company profile, besides, market price analysis and value chain features are covered in this report.

Product Type Coverage (Market Size & Forecast, Major Company of Product Type etc.):

Silicones
Epoxy
Polyurethane
Others
Company Coverage (Company Profile, Sales Revenue, Price, Gross Margin, Main Products etc.):
Dow Corning
Henkel
Hitachi Chemical
LORD Corporation
Huntsman Corporation
ITW Engineered Polymers
3M
H.B. Fuller
John C. Dolph
Master Bond
ACC Silicones
Epic Resins
Plasma Ruggedized Solutions

Application Coverage (Market Size & Forecast, Different Demand Market by Region, Main Consumer Profile etc.):

Consumer Electronics
Automotive
Medical
Telecommunications
Others

Region Coverage (Regional Production, Demand & Forecast by Countries etc.):

North America (U.S., Canada, Mexico)
Europe (Germany, U.K., France, Italy, Russia, Spain etc.)
Asia-Pacific (China, India, Japan, Southeast Asia etc.)
South America (Brazil, Argentina etc.)
Middle East & Africa (Saudi Arabia, South Africa etc.)