Snapshot
Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.
The global Electronic Potting & Encapsulating market will reach Volume Million USD in 2017 and CAGR xx% 2011-2017. The report begins from overview of Industry Chain structure, and describes industry environment, then analyses market size and forecast of Electronic Potting & Encapsulating by product, region and application, in addition, this report introduces market competition situation among the vendors and company profile, besides, market price analysis and value chain features are covered in this report.
Product Type Coverage (Market Size & Forecast, Major Company of Product Type etc.):
Silicones
Epoxy
Polyurethane
Others
Company Coverage (Sales Revenue, Price, Gross Margin, Main Products etc.):
Dow Corning
Henkel
Hitachi Chemical
LORD Corporation
Huntsman Corporation
ITW Engineered Polymers
3M
H.B. Fuller
John C. Dolph
Master Bond
ACC Silicones
Epic Resins
Plasma Ruggedized Solutions
Application Coverage (Market Size & Forecast, Different Demand Market by Region, Main Consumer Profile etc.):
Consumer Electronics
Automotive
Medical
Telecommunications
Others
Region Coverage (Regional Output, Demand & Forecast by Countries etc.):
North America
Europe
Asia-Pacific
South America
Middle East & Africa