Traditional LEDs usually undergo from the chip/die manufacturing to packaging processes where the die would be attached to an interposer such as a ceramic substrate, yielding a packaged LED or what is commonly referred to as an LED package. In the case of CSP LED, separate steps of having manufactured chips going through a packaging line are eliminated because at the die-level itself the chips are singulated and coated with phosphor. Solder or bond pads are installed at the wafer level just after the epitaxial stage of manufacturing using semiconductor etching and metallization techniques.
As fully functional LED packages that are equal to or slightly larger than the size of a die, CSPs are increasingly being implemented in lighting designs.

The global Chip Scale Packaged (CSP) LEDs market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Chip Scale Packaged (CSP) LEDs volume and value at global level, regional level and company level. From a global perspective, this report represents overall Chip Scale Packaged (CSP) LEDs market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Chip Scale Packaged (CSP) LEDs in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Chip Scale Packaged (CSP) LEDs manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

The following manufacturers are covered:
Lumileds
OSRAM
Samsung
Seoul Semiconductor
LG Innotek
Cree
Genesis Photonics
Nichia
EPISTAR
Lumens

Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India

Segment by Type
Low & Mid-Power
High-Power

Segment by Application
Backlighting Unit (BLU)
General Lighting
Flash Lighting
Automotive
Others