A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.

The global BGA Solder Ball market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on BGA Solder Ball volume and value at global level, regional level and company level. From a global perspective, this report represents overall BGA Solder Ball market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of BGA Solder Ball in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their BGA Solder Ball manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

The following manufacturers are covered:
Senju Metal
DS HiMetal
MKE
YCTC
Nippon Micrometal
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology

Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India

Segment by Type
Lead Solder Ball
Lead Free Solder Ball

Segment by Application
Lead-Free BGA Package
Lead BGA Package