3D NAND flash memory is no longer a simple planar memory stack. This is just one of them, as well as VC vertical channels and VG vertical gates. 3D NAND flash memory has SLC, MLC and TLC types
In 3D NAND flash memory, manufacturers do not necessarily announce a lot of technical details. In particular, there is little mention of specific process technologies. 3D NAND flash memory of other vendors except Samsung is only now coming to market, and representative products are not enough.

The global 3D NAND Flash market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on 3D NAND Flash volume and value at global level, regional level and company level. From a global perspective, this report represents overall 3D NAND Flash market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of 3D NAND Flash in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their 3D NAND Flash manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

The following manufacturers are covered:
Samsung Electronics
Toshiba/SanDisk
SK Hynix Semiconductor
Micron Technology
Intel Corporation
...

Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India

Segment by Type
MLC Type
TLC Type
Other

Segment by Application
SSD
Consumer Electronics