PART 01: EXECUTIVE SUMMARY PART 02: SCOPE OF THE REPORT PART 03: RESEARCH METHODOLOGY PART 04: MARKET LANDSCAPE • Market ecosystem • Market characteristics • Market segmentation analysis PART 05: MARKET SIZING • Market definition • Market sizing 2017 • Market size and forecast 2017-2022 PART 06: FIVE FORCES ANALYSIS • Bargaining power of buyers • Bargaining power of suppliers • Threat of new entrants • Threat of substitutes • Threat of rivalry • Market condition PART 07: MARKET SEGMENTATION BY END USER • Segmentation by end-user • Comparison by end-user • Foundry – Market size and forecast 2017-2022 • Memory – Market size and forecast 2017-2022 • IDMs – Market size and forecast 2017-2022 • Market opportunity by end-user PART 08: CUSTOMER LANDSCAPE PART 09: REGIONAL LANDSCAPE • Geographical segmentation • Regional comparison • APAC – Market size and forecast 2017-2022 • EMEA – Market size and forecast 2017-2022 • Americas – Market size and forecast 2017-2022 • Key leading countries • Market opportunity PART 10: DECISION FRAMEWORK PART 11: DRIVERS AND CHALLENGES • Market drivers • Market challenges PART 12: MARKET TRENDS • Increase in wafer size • Increase in number of fabless semiconductor companies • Strong focus on Internet of things PART 13: VENDOR LANDSCAPE • Overview • Landscape disruption PART 14: VENDOR ANALYSIS • Vendors covered • Market positioning of vendors • ADVANTEST • ASML • Hitachi High-Technologies • KLA-Tencor • Nanometrics PART 15: APPENDIX • List of abbreviations Exhibit 01: Parent market Exhibit 02: Global semiconductor capital equipment market Exhibit 03: Market characteristics Exhibit 04: Market segments Exhibit 05: Market definition - Inclusions and exclusions checklist Exhibit 06: Market size 2017 Exhibit 07: Validation techniques employed for market sizing 2017 Exhibit 08: Global – Market size and forecast 2017-2022 ($ mn) Exhibit 09: Global – Year-over-year growth 2018-2022 (%) Exhibit 10: Five forces analysis 2017 Exhibit 11: Five forces analysis 2022 Exhibit 12: Bargaining power of buyers Exhibit 13: Bargaining power of suppliers Exhibit 14: Threat of new entrants Exhibit 15: Threat of substitutes Exhibit 16: Threat of rivalry Exhibit 17: Market condition - Five forces 2017 Exhibit 18: End-user – Market share 2017-2022 (%) Exhibit 19: Comparison by end-user Exhibit 20: Foundry – Market size and forecast 2017-2022 ($ mn) Exhibit 21: Foundry – Year-over-year growth 2018-2022 (%) Exhibit 22: Memory – Market size and forecast 2017-2022 ($ mn) Exhibit 23: Memory – Year-over-year growth 2018-2022 (%) Exhibit 24: IDMs – Market size and forecast 2017-2022 ($ mn) Exhibit 25: IDMs – Year-over-year growth 2018-2022 (%) Exhibit 26: Market opportunity by end-user Exhibit 27: Customer landscape Exhibit 28: Global – Market share by geography 2017-2022 (%) Exhibit 29: Regional comparison Exhibit 30: APAC – Market size and forecast 2017-2022 ($ mn) Exhibit 31: APAC – Year-over-year growth 2018-2022 (%) Exhibit 32: EMEA – Market size and forecast 2017-2022 ($ mn) Exhibit 33: EMEA – Year-over-year growth 2018-2022 (%) Exhibit 34: Americas – Market size and forecast 2017-2022 ($ mn) Exhibit 35: Americas – Year-over-year growth 2018-2022 (%) Exhibit 36: Key leading countries Exhibit 37: Market opportunity Exhibit 38: Timeline for semiconductor wafer size advancements Exhibit 39: Vendor landscape Exhibit 40: Landscape disruption Exhibit 41: Vendors covered Exhibit 42: Vendor classification Exhibit 43: Market positioning of vendors Exhibit 44: ADVANTEST – Vendor overview Exhibit 45: ADVANTEST – Business segments Exhibit 46: ADVANTEST – Organizational developments Exhibit 47: ADVANTEST – Geographic focus Exhibit 48: ADVANTEST – Segment focus Exhibit 49: ADVANTEST – Key offerings Exhibit 50: ASML – Vendor overview Exhibit 51: ASML – Business segments Exhibit 52: ASML – Organizational developments Exhibit 53: ASML – Geographic focus Exhibit 54: ASML – Segment focus Exhibit 55: ASML– Key offerings Exhibit 56: Hitachi High-Technologies – Organizational developments Exhibit 57: Hitachi High-Technologies – Business segments Exhibit 58: Hitachi High-Technologies – Organizational developments Exhibit 59: Hitachi High-Technologies – Geographic focus Exhibit 60: Hitachi High-Technologies – Segment focus Exhibit 61: Hitachi High-Technologies – Key offerings Exhibit 62: KLA-Tencor – Vendor overview Exhibit 63: KLA-Tencor – Business segments Exhibit 64: KLA-Tencor – Organizational developments Exhibit 65: KLA-Tencor – Geographic focus Exhibit 66: KLA-Tencor – Segment focus Exhibit 67: KLA-Tencor – Key offerings Exhibit 68: Nanometrics – Vendor overview Exhibit 69: Nanometrics – Business segments Exhibit 70: Nanometrics – Organizational developments Exhibit 71: Nanometrics – Geographic focus Exhibit 72: Nanometrics – Segment focus Exhibit 73: Nanometrics – Key offerings

ADVANTEST, ASML, Hitachi High-Technologies, KLA-Tencor, and Nanometrics.