Table of contents PART 01: EXECUTIVE SUMMARY PART 02: SCOPE OF THE REPORT PART 03: RESEARCH METHODOLOGY PART 04: MARKET LANDSCAPE Market ecosystem Market characteristics Market segmentation analysis PART 05: MARKET SIZING Market definition Market sizing 2017 Market size and forecast 2017-2022 PART 06: FIVE FORCES ANALYSIS Bargaining power of buyers Bargaining power of suppliers Threat of new entrants Threat of substitutes Threat of rivalry Market condition PART 07: MARKET SEGMENTATION BY APPLICATION Segmentation by application Comparison by application UPS&PS – Market size and forecast 2017-2022 PV inverters – Market size and forecast 2017-2022 IMDs – Market size and forecast 2017-2022 EV/HEVs – Market size and forecast 2017-2022 Others – Market size and forecast 2017-2022 Market opportunity by application PART 08: MARKET SEGMENTATION BY PRODUCT Segmentation by product Comparison by product Diodes – Market size and forecast 2017-2022 Transistors – Market size and forecast 2017-2022 Modules – Market size and forecast 2017-2022 Market opportunity by product PART 09: CUSTOMER LANDSCAPE PART 10: REGIONAL LANDSCAPE Geographical segmentation Regional comparison APAC – Market size and forecast 2017-2022 EMEA – Market size and forecast 2017-2022 Americas – Market size and forecast 2017-2022 Market opportunity PART 11: DECISION FRAMEWORK PART 12: DRIVERS AND CHALLENGES Market drivers Market challenges PART 13: MARKET TRENDS Transition toward larger SiC wafer Entrance of multiple suppliers of SiC wafers Implementation of automation in industries Use of SiC power devices for extreme operations PART 14: VENDOR LANDSCAPE Competitive scenario Overvie Landscape disruption PART 15: VENDOR ANALYSIS0 Vendors covered Vendor classification Market positioning of vendors Cree Infineon Technologies Mitsubishi Electric ON Semiconductor ROHM Semiconductor STMicroelectronics TOSHIBA PART 16: APPENDIX List of abbreviations