Table of Contents PART 01: EXECUTIVE SUMMARY PART 02: SCOPE OF THE REPORT PART 03: RESEARCH METHODOLOGY PART 04: MARKET LANDSCAPE • Market outline • Semiconductor value chain • Market ecosystem • Market characteristics • Market segmentation analysis PART 05: MARKET SIZING • Market definition • Market sizing 2017 • Market size and forecast 2017-2022 PART 06: FIVE FORCES ANALYSIS • Bargaining power of buyers • Bargaining power of suppliers • Threat of new entrants • Threat of substitutes • Threat of rivalry • Market condition PART 07: MARKET SEGMENTATION BY TYPE • Segmentation by type • Comparison by type • High-density etch equipment – Market size and forecast 2017-2022 • Low-density etch equipment – Market size and forecast 2017-2022 • Market opportunity by type PART 08: CUSTOMER LANDSCAPE PART 09: MARKET SEGMENTATION BY END-USER • Segmentation by end-user • Comparison by end-user • Foundries – Market size and forecast 2017-2022 • Memory manufacturers– Market size and forecast 2017-2022 • IDMs – Market size and forecast 2017-2022 • Market opportunity by end-user PART 10: REGIONAL LANDSCAPE • Geographical segmentation • Regional comparison • APAC – Market size and forecast 2017-2022 • Americas – Market size and forecast 2017-2022 • EMEA – Market size and forecast 2017-2022 • Key leading countries • South Korea • Taiwan • China • Japan • Market opportunity PART 11: DECISION FRAMEWORK PART 12: DRIVERS AND CHALLENGES • Market drivers • Market challenges PART 13: MARKET TRENDS • Increase in wafer size • Significant development of the Chinese semiconductor industry • Use of NEMS • Improved FinFET architecture • Emergence of dual damascene etch process PART 14: VENDOR LANDSCAPE • Overview • Landscape disruption • Competitive scenario PART 15: VENDOR ANALYSIS • Vendors covered • Vendor classification • Market positioning of vendors • Applied Materials • Hitachi High-Technologies • Lam Research • Tokyo Electron PART 16: APPENDIX • List of abbreviations List of Exhibits Exhibit 01: Semiconductor value chain Exhibit 02: Description of semiconductor value chain Exhibit 03: Parent market Exhibit 04: Global semiconductor capital equipment market Exhibit 05: Market characteristics Exhibit 06: Market segments Exhibit 07: Market definition – Inclusions and exclusions checklist Exhibit 08: Market size 2017 Exhibit 09: Validation techniques employed for market sizing 2017 Exhibit 10: Global – Market size and forecast 2017-2022 ($ bn) Exhibit 11: Global – Year-over-year growth 2018-2022 (%) Exhibit 12: Five forces analysis 2017 Exhibit 13: Five forces analysis 2022 Exhibit 14: Bargaining power of buyers Exhibit 15: Bargaining power of suppliers Exhibit 16: Threat of new entrants Exhibit 17: Threat of substitutes Exhibit 18: Threat of rivalry Exhibit 19: Market condition - Five forces 2017 Exhibit 20: Type – Market share 2017-2022 (%) Exhibit 21: Comparison by type Exhibit 22: High-density etch equipment – Market size and forecast 2017-2022 ($ bn) Exhibit 23: High-density etch equipment – Year-over-year growth 2018-2022 (%) Exhibit 24: Share of metal and silicon etch equipment in high-density etch equipment 2017-2022 (%) Exhibit 25: Low-density etch equipment – Market size and forecast 2017-2022 ($ bn) Exhibit 26: Low-density etch equipment – Year-over-year growth 2018-2022 (%) Exhibit 27: Market opportunity by type Exhibit 28: Customer landscape Exhibit 29: End-user – Market share 2017-2022 (%) Exhibit 30: Comparison by end-user Exhibit 31: Foundries – Market size and forecast 2017-2022 ($ bn) Exhibit 32: Foundries – Year-over-year growth 2018-2022 (%) Exhibit 33: Memory manufacturers – Market size and forecast 2017-2022 ($ bn) Exhibit 34: Memory manufacturers – Year-over-year growth 2018-2022 (%) Exhibit 35: IDMs – Market size and forecast 2017-2022 ($ bn) Exhibit 36: IDMs – Year-over-year growth 2018-2022 (%) Exhibit 37: Market opportunity by end-user Exhibit 38: Global – Market share by geography 2017-2022 (%) Exhibit 39: Regional comparison Exhibit 40: APAC – Market size and forecast 2017-2022 ($ bn) Exhibit 41: APAC – Year-over-year growth 2018-2022 (%) Exhibit 42: Americas – Market size and forecast 2017-2022 ($ bn) Exhibit 43: Americas – Year-over-year growth 2018-2022 (%) Exhibit 44: EMEA – Market size and forecast 2017-2022 ($ bn) Exhibit 45: EMEA – Year-over-year growth 2018-2022 (%) Exhibit 46: Key leading countries Exhibit 47: Market opportunity Exhibit 48: Global semiconductor market trend 1990-2017 ($ bn) Exhibit 49: Timeline of advances in semiconductor wafer size Exhibit 50: Vendor landscape Exhibit 51: Landscape disruption Exhibit 52: Vendors covered Exhibit 53: Vendor classification Exhibit 54: Market positioning of vendors Exhibit 55: Vendor overview Exhibit 56: Applied Materials – Business segments Exhibit 57: Applied Materials – Organizational developments Exhibit 58: Applied Materials – Geographic focus Exhibit 59: Applied Materials – Segment focus Exhibit 60: Applied Materials – Key offerings Exhibit 61: Vendor overview Exhibit 62: Hitachi High-Technologies – Business segments Exhibit 63: Hitachi High-Technologies – Organizational developments Exhibit 64: Hitachi High-Technologies – Geographic focus Exhibit 65: Hitachi High-Technologies – Segment focus Exhibit 66: Hitachi High-Technologies – Key offerings Exhibit 67: Vendor overview Exhibit 68: Lam Research – Business segments Exhibit 69: Lam Research – Organizational developments Exhibit 70: Lam Research – Geographic focus Exhibit 71: Lam Research – Segment focus Exhibit 72: Lam Research – Key offerings Exhibit 73: Vendor overview Exhibit 74: Tokyo Electron – Business segments Exhibit 75: Tokyo Electron – Organizational developments Exhibit 76: Tokyo Electron – Geographic focus Exhibit 77: Tokyo Electron – Segment focus Exhibit 78: Tokyo Electron – Key offerings

Applied Materials, Hitachi High-Technologies, Lam Research, and Tokyo Electron.