Table of Contents PART 01: EXECUTIVE SUMMARY PART 02: SCOPE OF THE REPORT PART 03: RESEARCH METHODOLOGY PART 04: INTRODUCTION • Market outline PART 05: MARKET LANDSCAPE • Market ecosystem • Market characteristics • Market segmentation analysis PART 06: MARKET SIZING • Market definition • Market sizing 2016 • Market size and forecast 2016-2021 PART 07: FIVE FORCES ANALYSIS • Bargaining power of buyers • Bargaining power of suppliers • Threat of new entrants • Threat of substitutes • Threat of rivalry • Market condition PART 08: CUSTOMER LANDSCAPE PART 09: MARKET SEGMENTATION BY MATERIAL TYPE • Segmentation by material type • Organic substrates – Market size and forecast 2016-2021 • Lead frames – Market size and forecast 2016-2021 • Bonding wires – Market size and forecast 2016-2021 • Others – Market size and forecast 2016-2021 • Market opportunity by type of materials PART 10: REGIONAL LANDSCAPE • Geographical segmentation • APAC – Market size and forecast 2016-2021 • Americas – Market size and forecast 2016-2021 • EMEA – Market size and forecast 2016-2021 • Market opportunity PART 11: DECISION FRAMEWORK PART 12: DRIVERS AND CHALLENGES • Market drivers • Market challenges PART 13: MARKET TRENDS • Increase in adoption of flip-chip, Sip, lead-free packaging solutions • Growing preference of SMT (surface mount technology) over older through-hole technology and surge in popularity of redistributed chip packaging • Surge in adoption of semiconductor ICs for automobiles and shift toward copper as bonding wire material PART 14: VENDOR LANDSCAPE • Competitive scenario PART 15: VENDOR ANALYSIS • Vendors covered • Vendor classification • Market positioning of vendors • Amkor Technology • DuPont • Henkel • Honeywell • Kyocera • Toppan Printing PART 16: APPENDIX • List of abbreviations List of Exhibits Exhibit 01: Steps in back-end chip formation Exhibit 02: Roadmap of semiconductor packaging Exhibit 03: Old supply chain of semiconductor IC packaging industry Exhibit 04: New supply chain of semiconductor IC packaging industry Exhibit 05: Related market Exhibit 06: Semiconductor packaging materials technologies Exhibit 07: Global semiconductor packaging materials market overview Exhibit 08: Market characteristics Exhibit 09: Market segments Exhibit 10: Market definition - Inclusions and exclusions checklist Exhibit 11: Market size 2016 Exhibit 12: Validation techniques employed for market sizing 2016 Exhibit 13: Global semiconductor packaging materials – Market size and forecast 2016-2021 ($ billions) Exhibit 14: Global semiconductor packaging materials market– Year-over-year growth 2017-2021 (%) Exhibit 15: Five forces analysis 2016 Exhibit 16: Five forces analysis 2021 Exhibit 17: Bargaining power of buyers Exhibit 18: Bargaining power of suppliers Exhibit 19: Threat of new entrants Exhibit 20: Threat of substitutes Exhibit 21: Threat of rivalry Exhibit 22: Market condition in 2016 - Five forces Exhibit 23: Customer landscape Exhibit 24: Global semiconductor packaging materials by market type 2016-2021 (%) Exhibit 25: Comparison by end-user Exhibit 26: Organic substrates – Market size and forecast 2016-2021 ($ billions) Exhibit 27: Organic substrates – Year-over-year growth 2017-2021 (%) Exhibit 28: Lead frames – Market size and forecast 2016-2021 ($ billions) Exhibit 29: Lead frames – Year-over-year growth 2017-2021 (%) Exhibit 30: Bonding wires – Market size and forecast 2016-2021 ($ billions) Exhibit 31: Bonding wires – Year over year growth 2017-2021 (%) Exhibit 32: Others – Market size and forecast 2016-2021 ($ billions) Exhibit 33: Others – Year-over-year growth 2017-2021 (%) Exhibit 34: Market opportunity by material type Exhibit 35: Global semiconductor packaging materials market share by geography 2016-2021 (%) Exhibit 36: Regional comparison Exhibit 37: APAC – Market size and forecast 2016-2021 ($ billions) Exhibit 38: APAC – Year-over-year growth 2017-2021 (%) Exhibit 39: Top 3 countries in Americas Exhibit 40: Americas – Market size and forecast 2016-2021 ($ billions) Exhibit 41: Americas – Year-over-year growth 2017-2021 (%) Exhibit 42: Top 3 countries in EMEA Exhibit 43: EMEA – Market size and forecast 2016-2021 ($ billions) Exhibit 44: EMEA – Year-over-year growth 2017-2021 (%) Exhibit 45: Top 3 countries in APAC Exhibit 46: Vendor classification Exhibit 47: Market positioning of vendors Exhibit 48: Amkor Technology overview Exhibit 49: Amkor Technology – Business segments Exhibit 50: Amkor Technology– Organizational developments Exhibit 51: Amkor Technology– Geographic focus Exhibit 52: Amkor Technology – Business segment focus Exhibit 53: Amkor Technology – Key application packaging products Exhibit 54: DuPont overview Exhibit 55: DuPont – Business segments Exhibit 56: Dupont – Organizational developments Exhibit 57: Dupont – Geographic focus Exhibit 58: Dupont – Segment focus Exhibit 59: Dupont – Key offerings Exhibit 60: Henkel overview Exhibit 61: Henkel – Business segments Exhibit 62: Henkel – Organizational developments Exhibit 63: Henkel – Geographic focus Exhibit 64: Henkel – Segment focus Exhibit 65: Henkel – Key offerings Exhibit 66: Honeywell overview Exhibit 67: Honeywell – Business segments Exhibit 68: Honeywell – Organizational developments Exhibit 69: Honeywell – Geographic focus Exhibit 70: Honeywell – Segment focus Exhibit 71: Honeywell – Key offerings Exhibit 72: Kyocera overview Exhibit 73: Kyocera – Business segments Exhibit 74: Kyocera – Organizational developments Exhibit 75: Kyocera – Geographic focus Exhibit 76: Kyocera – Segment focus Exhibit 77: Kyocera – Key offerings Exhibit 78: Toppan Printing overview Exhibit 79: Toppan Printing – Business segments Exhibit 80: Toppan Printing – Organizational developments Exhibit 81: Toppan Printing – Geographic focus Exhibit 82: Toppan Printing – Segment focus Exhibit 83: Toppan Printing – Key offerings

Amkor Technology, DuPont, Henkel, Honeywell, Kyocera, Toppan Printing, Hitachi Chemical, ASM Pacific Technology, BASF, and Beijing Kehua New Chemical Technology.