PART 01: Executive summary PART 02: Scope of the report PART 03: Research Methodology PART 04: Introduction • Market outline • Wafer dicing saws PART 05: Market landscape • Market overview • Market size and forecast PART 06: Five forces analysis • Five forces analysis PART 07: Market segmentation by end-user • Pureplay foundries • IDMs • PART 08: Market segmentation by packaging technology • BGA • QFN PART 09: Geographical segmentation • Market overview • APAC • Americas • EMEA PART 10: Key leading countries • Taiwan • China • Decision framework PART 11: Drivers and challenges • Market drivers • Market challenges PART 12: Market trends • Growth of AI • Increase in wafer size • Introduction of ultrasonic blade dicing • Growth of smart cities PART 13: Vendor landscape • Competitive scenario PART 14: Key vendor analysis • DISCO Corporation • TOKYO SEIMITSU • Advanced Dicing Technology • Dynatex International • Loadpoint • Micross Components PART 15: Appendix • List of abbreviations List of Exhibits Exhibit 01: Types of dicing equipment Exhibit 02: Global wafer dicing saws market: Overview Exhibit 03: Global wafer dicing saws market 2016-2021 ($ millions) Exhibit 04: Five forces analysis Exhibit 05: Global wafer dicing saws market by end user in 2016 (% share) Exhibit 06: Global wafer dicing saws market by end user 2016-2021 ($ millions) Exhibit 07: Global wafer dicing saws market by pureplay foundries 2016-2021 ($ millions) Exhibit 08: Global wafer dicing saws market by IDMs ($ millions) Exhibit 09: Global wafer dicing saws market by technology in 2016 ($ millions) Exhibit 10: Global wafer dicing saws market by technology 2016-2021 ($ millions) Exhibit 11: Global wafer dicing saws market by BGA 2016-2021 ($ millions) Exhibit 12: Global wafer dicing saws by QFN 2016-2021 ($ millions) Exhibit 13: Global wafer dicing saws market: Segmentation by geography in 2016 (% share) Exhibit 14: Global wafer dicing saws market by geography 2016-2021 ($ millions) Exhibit 15: Wafer dicing saws market in APAC 2016-2021 ($ millions) Exhibit 16: Major semiconductor foundries located in the APAC (% share) Exhibit 17: Wafer dicing saws market in Americas 2016-2021 ($ millions) Exhibit 18: Wafer dicing saws market in EMEA 2016-2021 ($ millions) Exhibit 19: Key leading countries (% share) Exhibit 20: Basic criteria for selecting a dicing blade Exhibit 21: Die strength comparison between mechanical blade dicing saw and laser dicing saw (Mpa) Exhibit 22: Timeline for increasing wafer size 1975-2017 Exhibit 23: Partner cities selected in EU and China under PDSF initiative Exhibit 24: DISCO Corporation: Recent developments Exhibit 25: TOKYO SEIMITSU: Recent developments Exhibit 26: Micross Components: Recent developments

DISCO Corporation, TOKYO SEIMITSU, Advanced Dicing Technology, Dynatex International, Loadpoint, and Micross Components