Table of Contents PART 01: Executive summary PART 02: Scope of the report PART 03: Research Methodology PART 04: Introduction • Market outline PART 05: Market landscape • Market overview • Market size and forecast • Five forces analysis PART 06: Market segmentation by technology type • Global wafer inspection equipment market by technology • Optical technology • E-beam technology PART 07: Market segmentation by wafer type • Global wafer inspection equipment market by wafer type • Patterned wafer inspection equipment • Unpatterned wafer inspection equipment PART 08: Market segmentation end-user • Global wafer inspection equipment market by end-user PART 09: Geographical segmentation • Global wafer inspection equipment market by geography PART 10: Key leading countries • Key leading countries • Taiwan • South Korea • Japan • China PART 11: Decision framework PART 12: Drivers and challenges • Market drivers • Market challenges PART 13: Market trends • Growing requirement for memory devices • Change in wafer size • Development of multi-beam e-beam inspection • Advent of FOWLP technology • Continuous decrease in lithography wavelength PART 14: Vendor landscape • Competitive landscape • Key vendors List of Exhibits Exhibit 01: Overview of global wafer inspection equipment market Exhibit 02: Global wafer inspection equipment market 2016-2021 ($ billions) Exhibit 03: Five forces analysis Exhibit 04: Global wafer inspection equipment market by technology 2016-2021 (% share of revenue) Exhibit 05: Revenue trend-line of global wafer inspection equipment market by technology 2016-2021 ($ billions) Exhibit 06: Global optical wafer inspection equipment market 2016-2021 ($ billions) Exhibit 07: Global e-beam wafer inspection equipment market 2016-2021 ($ billions) Exhibit 08: Global wafer inspection equipment market by wafer type 2016-2021 (% share of revenue) Exhibit 09: Global wafer inspection equipment market by wafer type 2016-2021 ($ billions) Exhibit 10: Global patterned wafer inspection equipment market 2016-2021 ($ billions) Exhibit 11: E-beam wafer inspection process chart Exhibit 12: Patterned wafer inspection equipment market share based on technology (%) Exhibit 13: Comparison between optical and e-beam wafer inspection equipment Exhibit 14: Global unpatterned wafer inspection equipment market 2016-2021 ($ billions) Exhibit 15: Strengths and limitations of unpatterned wafer inspection equipment Exhibit 16: Global wafer inspection equipment market by end-user 2016-2021 (% share of revenue) Exhibit 17: Revenue trend-line global wafer inspection equipment market by end-user 2016-2021 ($ billions) Exhibit 18: Global wafer inspection equipment market for foundries 2016-2021 ($ billions) Exhibit 19: Global wafer inspection equipment market for memory manufacturers 2016-2021 ($ billions) Exhibit 20: Global wafer inspection equipment market for IDMs 2016-2021 ($ billions) Exhibit 21: Global wafer inspection equipment market by geography 2016-2021 (% share of revenue) Exhibit 22: Revenue trend-line of global wafer inspection equipment by geography 2016-2021 ($ billions) Exhibit 23: Wafer inspection equipment market in APAC 2016-2021 ($ billions) Exhibit 24: Wafer inspection equipment market in Americas 2016-2021 ($ billions) Exhibit 25: Wafer inspection equipment market in EMEA 2016-2021 ($ billions) Exhibit 26: Key leading countries Exhibit 27: Percentage share of key leading countries during the forecast period Exhibit 28: Global NAND flash market 2016-2021 (% share) Exhibit 29: Global semiconductor market trend 1990-2016 ($ billions) Exhibit 30: CAGR of 3D NAND and DRAM for the forecast period Exhibit 31: Timeline for semiconductor wafer size advances Exhibit 32: Node transition in the semiconductor industry Exhibit 33: Market share of key vendors in the global semiconductor wafer inspection equipment market 2016 (%) Exhibit 34: Other prominent vendors

Applied Materials, Hermes Microvision (ASML), KLA-Tencor, Lasec Corporation, Zeiss Global, FEI (Thermo Fisher Scientific), Hitachi High-Technologies, JEOL, Lam Research, Nanometrics, Nikon, Planar Corporation, Rudolph Technologies, Tokyo Seimitsu, and Toray Engineering.