Table of Contents PART 01: Executive summary PART 02: Scope of the report PART 03: Research Methodology PART 04: Introduction • Key market highlights PART 05: Market landscape • Overview of semiconductor packaging and assembly equipment • Ecosystem of semiconductor IC packaging industry • Market overview • Market size and forecast • Five forces analysis PART 06: Market segmentation by end-user • Market overview • OSATs • IDMs PART 07: Geographical segmentation • Die bonder equipment market in APAC • Die bonder equipment market in Americas • Die bonder equipment market in EMEA PART 08: Key leading countries • Taiwan • South Korea • Japan • China PART 09: Decision framework PART 10: Drivers and challenges • Market drivers • Impact of drivers on key customer segments • Market challenges • Impact of challenges on key customer segments PART 11: Market trends • Growing use of 3D chip packaging • Increase in number of OSAT vendors • Increase in M&A in the semiconductor packaging and assembly market • Advent of FOWLP technology • Automation in automobiles PART 12: Vendor landscape • Competitive scenario • Major vendors • Other prominent vendors PART 13: Appendix • List of abbreviations List of Exhibits Exhibit 01: Steps involved in back-end chip formation Exhibit 02: Supply chain in traditional semiconductor IC packaging industry Exhibit 03: Supply chain in new semiconductor IC packaging industry Exhibit 04: Global die bonder market Exhibit 05: Global die bonder equipment market 2016-2021 ($ millions) Exhibit 06: Five forces analysis Exhibit 07: Global die bonder equipment market: Segmentation by end-user 2016-2021 (% share) Exhibit 08: Global die bonder equipment market: Segmentation by end-user 2016-2021 ($ million) Exhibit 09: Global die bonder equipment market by OSATs 2016-2021 ($ millions) Exhibit 10: Global die bonder equipment market by IDMs 2016-2021 ($ millions) Exhibit 11: Global die bonder equipment market: Segmentation by geography 2016-2021 (% share) Exhibit 12: Global die bonder equipment market: Segmentation by region-wise revenue trend-line 2016-2021 ($ millions) Exhibit 13: Die bonder equipment market in APAC 2016-2021 ($ millions) Exhibit 14: Die bonder equipment market in Americas 2016-2021 ($ millions) Exhibit 15: Die bonder equipment market in EMEA 2016-2021 ($ millions) Exhibit 16: Key leading countries Exhibit 17: Percentage share of key leading countries over the forecast period (2016-2021) Exhibit 18: Impact of drivers Exhibit 19: Global semiconductor market trend 1992-2016 ($ billions) Exhibit 20: Impact of challenges Exhibit 21: Global automobile unit production 2016-2021 (Million units) Exhibit 22: Other vendors in the global die bonder equipment market

ASM Pacific Technology (ASMPT), Kulicke & Soffa, Palomar Technologies, Besi, DIAS Automation, Hesse, Hybond, SHINKAWA, Toray Engineering, and West-Bond.