Global Sputtering Equipment Market 2017-2021
SKU ID :TNV-10533894 | Published Date: 20-Feb-2017 | No. of pages: 85Description
TOC
Table of Contents
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Research Methodology
PART 04: Introduction
Key market highlights
PART 05: Market landscape
Market overview
Market size and forecast
Five forces analysis
PART 06: Market segmentation by type
Logic
Memory
Analog
Discrete
PART 07: Market segmentation by application
Consumer electronics
Automotive sector
Healthcare electronics
Others
PART 08: Geographical segmentation
Market overview
PART 09: Key leading countries
Taiwan
South Korea
Japan
China
PART 10: Market drivers
Increased use of electronic semiconductor devices
Consumer electronics driving semiconductor equipment industry
Increased demand for miniaturized ICs
Increasing number of fabless semiconductor companies
PART 11: Impact of drivers
PART 12: Market challenges
Variations in semiconductor industry
Impact of currency fluctuations
Technological survival in the long run
PART 13: Impact of drivers and challenges
PART 14: Market trends
Increasing demand for semiconductor ICs from automobiles
IoT trending in the semiconductor market
Transitions in wafer size
Emerging FinFET architecture and 3D ICs
PART 15: Vendor landscape
Competitive scenario
Other prominent vendors
PART 16: Appendix
List of abbreviations
PART 17: Explore Technavio
List of Exhibits
Exhibit 01: Key market highlights
Exhibit 02: Global sputtering equipment market overview
Exhibit 03: Global sputtering equipment market overview 2016-2021 ($ millions)
Exhibit 04: Five forces analysis
Exhibit 05: Types of semiconductor components
Exhibit 06: Global sputtering market by type 2016-2021 (revenue share)
Exhibit 07: Global sputtering equipment market by logic 2016-2021 ($ millions)
Exhibit 08: Global sputtering equipment market by memory 2016-2021 ($ millions)
Exhibit 09: Global sputtering market by analog 2016-2021($ millions)
Exhibit 10: global sputtering equipment market by discrete 2016-2021 ($ millions)
Exhibit 11: Global sputtering market by application
Exhibit 12: Global sputtering equipment market by application 2016-2021 (revenue share)
Exhibit 13: Global sputtering market in consumer electronics 2016-2021 ($ millions)
Exhibit 14: Global sputtering market in automotive sector 2016-2021 ($ millions)
Exhibit 15: Global sputtering market in healthcare electronics 2016-2021 ($ millions)
Exhibit 16: Global sputtering market in others segment 2016-2021 ($ millions)
Exhibit 17: Global sputtering equipment market by geography 2016 ($ millions)
Exhibit 18: Global sputtering equipment market by geography 2016-2021 (revenue share)
Exhibit 19: Sputtering equipment market in APAC ($ millions)
Exhibit 20: Top semiconductor manufacturers in APAC 2016
Exhibit 21: Fab equipment expenditure 2015-2017
Exhibit 22: Sputtering equipment market in Americas 2016-2021 ($ millions)
Exhibit 23: Top semiconductor manufacturers in US 2016
Exhibit 24: Sputtering equipment market in EMEA ($ millions)
Exhibit 25: Top semiconductor manufacturers in Europe 2016
Exhibit 26: Key leading countries
Exhibit 27: Semiconductor applications forecast 2016 and 2021 (% share)
Exhibit 28: Global NAND flash market 2016-2021 (% share)
Exhibit 29: Global MEMS market 2016-2021 ($ billions)
Exhibit 30: Market share of fabless companies and IDMs by region 2015 (revenue share)
Exhibit 31: Impact of drivers
Exhibit 32: Decreasing semiconductor revenue forecast (revenue share)
Exhibit 33: TWD per 1 USD monthly average 2016
Exhibit 34: Impact of drivers and challenges
Exhibit 35: IoT sensor and semiconductor hardware market forecast ($ billions)
Exhibit 36:0 mm and 450 mm wafer size forecast 2016 and 2021 (number of fabs)
Exhibit 37: Applied Materials: Business segmentation 2016 (revenue share)
Exhibit 38: Applied Materials: Product overview
Exhibit 39: Applied Materials: Recent developments
Exhibit 40: Canon Anelva Corporation: Product overview
Exhibit 41: ULVAC Technologies: Product overview
Exhibit 42: Other prominent vendors
Tables & Figures
Companies
Applied Materials, Canon Anelva Corporation, Oerlikon, ULVAC Technologies, BOBST, IZOVAC, JX Nippon Mining & Metals, KOBE STEEL, Kolzer, Satisloh.
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