Table of Contents PART 01: Executive summary PART 02: Scope of the report • Market overview • Base year • Market reportage • Geographical coverage • Vendor segmentation • Common currency conversion rates • Top-vendor offerings PART 03: Market research methodology • Research methodology • Economic indicators PART 04: Introduction • Key market highlights PART 05: Technology landscape • Semiconductor IC manufacturing process • WLP versus die-level packaging and assembly • Roadmap of semiconductor packaging industry • Ecosystem of semiconductor IC packaging industry PART 06: Market landscape • Market overview • Market size and forecast • Five forces analysis PART 07: Market segmentation by OSATs and IDMs • Global semiconductor chip packaging market by OSATs and IDMs • OSATs • IDMs PART 08: Market segmentation by packaging techniques • Flip-chip wafer bumping • 2.5D interposers • Fan-in WL CSP • 3D WLP • FO WLP/SiP • 3D IC TSV stacks PART 09: Geographical segmentation • Market overview • APAC • Americas • EMEA PART 10: Key leading countries • USA • Taiwan PART 11: Market drivers • Growing number of fabs • Increase in miniaturization of electronic devices • High adoption of semiconductor ICs in automobiles • Increase in number of fabless semiconductor companies PART 12: Impact of drivers PART 13: Market challenges • High initial investment • Increasing complexity of semiconductor IC designs • Rapid technological changes PART 14: Impact of drivers and challenges PART 15: Market trends • Development of 3D chip packaging • Growing popularity of FOWLP technology • Increase in wafer size PART 16: Vendor landscape • Competitive scenario • Vendor landscape PART 17: Appendix • List of abbreviations PART 18: Explore Technavio List of Exhibits Exhibit 01: List of countries in key regions Exhibit 02: Currency conversions Exhibit 03: Product offerings Exhibit 04: Semiconductor IC manufacturing process Exhibit 05: Front-end chip formation steps Exhibit 06: Back-end chip formation steps Exhibit 07: Semiconductor packaging industry Exhibit 08:.5D IC block diagram Exhibit 09:D IC block diagram Exhibit 10: Old semiconductor IC packaging industry supply chain Exhibit 11: New semiconductor IC packaging industry supply chain Exhibit 12: Global semiconductor chip packaging market segmentation Exhibit 13: Global semiconductor chip packaging market 2016-2021 ($ billions) Exhibit 14: Five forces analysis Exhibit 15: Global semiconductor chip packaging market by OSATs and IDMs2016 (% share) Exhibit 16: Global semiconductor chip packaging market by end-user 2021 (% share) Exhibit 17: Global semiconductor chip packaging market segmentation by packaging techniques 2016-2021 (% share) Exhibit 18: Global semiconductor chip packaging market segmentation by packaging techniques 2016-2021 ($ billions) Exhibit 19: Global semiconductor chip packaging market for flip-chip wafer bumping 2016-2021 ($ billions) Exhibit 20: Global semiconductor chip packaging market for 2.5D interposers 2016-2021 ($ billions) Exhibit 21: Global semiconductor chip packaging market for fan-in WL CSP 2016-2021 ($ billions) Exhibit 22: Global semiconductor chip packaging market by 3D WLP 2016-2020 ($ billions) Exhibit 23: Global semiconductor chip packaging market for FO WLP/SiP 2016-2021 ($ billions) Exhibit 24: Global semiconductor chip packaging market for 3DIC TSV stacks 2016-2021 ($ billions) Exhibit 25: Global semiconductor chip packaging market by geography 2016-2021 (% share) Exhibit 26: Global semiconductor chip packaging market by geography 2015-2021 ($ billions) Exhibit 27: Key leading countries Exhibit 28: Global semiconductor chip packaging market 2016-2021 (% share) Exhibit 29: Global MEMS market 2016-2021 ($ billions) Exhibit 30: Cars shipment growth 2016-2021 (%) Exhibit 31: Impact of drivers Exhibit 32: Impact of drivers and challenges Exhibit 33: Timeline for semiconductor wafer size advances Exhibit 34: Other vendors in global semiconductor chip packaging market

Applied Materials, ASM Pacific Technology, Kulicke & Soffa Industries, TEL, Tokyo Seimitsu.