PART 01: Executive summary • Highlights PART 02: Scope of the report • Market coverage • Base year and forecast period • Vendor segmentation • Market segmentation • Geographical segmentation PART 03: Market research methodology • Research methodology • Economic indicators • PEST analysis PART 04: Introduction • Key market highlights PART 05: Technology landscape • Semiconductor IC manufacturing process • WLP versus die-level packaging and assembly • Roadmap of semiconductor packaging industry • Ecosystem of semiconductor IC packaging industry PART 06: Market landscape • Market size and forecast • Five forces analysis PART 07: Market segmentation by application • Global fan-in WLP market by application • Analog and mixed ICs • Wireless connectivity • Logic and memory ICs • MEMS and sensors • CMOS image sensors PART 08: Geographical segmentation • Global fan-in WLP market by geography 2015-2020 • APAC • North America • Europe PART 09: Market drivers • High demand for miniaturized electronics • Growing application of semiconductor ICs in IoT • Increasing complexity of semiconductor IC designs • Surging demand for semiconductor wafers PART 10: Impact of drivers PART 11: Market challenges • Cyclical nature of semiconductor industry • Rapid technological changes in wafer processing PART 12: Impact of drivers and challenges PART 13: Market trends • Increase in wafer size • High adoption of semiconductor ICs in automobiles • Short replacement cycle of mobile devices PART 14: Vendor landscape • Competitive scenario • Key vendors • Other prominent vendors PART 15: Market summary PART 16: Appendix • List of abbreviations PART 17: Explore Technavio   List of Exhibits Exhibit 01: Global fan-in WLP market segmentation 2015 Exhibit 02: Key regions Exhibit 03: PEST analysis Exhibit 04: Semiconductor IC manufacturing process Exhibit 05: Front-end chip formation steps Exhibit 06: Back-end chip formation steps Exhibit 07: Roadmap of semiconductor packaging industry Exhibit 08:.5D IC block diagram Exhibit 09:D IC block diagram Exhibit 10: Old semiconductor IC packaging industry supply chain Exhibit 11: New semiconductor IC packaging industry supply chain Exhibit 12: Global fan-in WLP market 2015-2020 ($ billions) Exhibit 13: Global fan-in WLP market 2015-2020 (billions of units) Exhibit 14: Five forces analysis Exhibit 15: Global fan-in WLP market by application 2015-2020 (% share of shipments) Exhibit 16: Global fan-in WLP market by application 2015-2020 (billions of units) Exhibit 17: Global fan-in WLP market by analog and mixed IC 2015-2020 (billions of units) Exhibit 18: Global fan-in WLP market by wireless connectivity 2015-2020 (billions of units) Exhibit 19: Global fan-in WLP market by logic and memory IC 2015-2020 (billions of units) Exhibit 20: Global fan-in WLP market by MEMS and sensors 2015-2020 (billions of units) Exhibit 21: Global fan-in WLP market by CMOS image sensor 2015-2020 (billions of units) Exhibit 22: Global fan-in WLP market by geography 2015-2020 (% share of shipment) Exhibit 23: Global fan-in WLP market by geography 2015-2020 (billions of units) Exhibit 24: Fan-in WLP market in APAC 2015-2020 (billions of units) Exhibit 25: Fan-in WLP market in North America 2015-2020 (billions of units) Exhibit 26: Fan-in WLP market in Europe 2015-2020 (billions of units) Exhibit 27: Global MEMS market 2015-2020 ($ billions) Exhibit 28: Global smartphone shipment forecast 2015-2020 (millions of units) Exhibit 29: Impact of drivers Exhibit 30: Impact of drivers (continued) Exhibit 31: Global semiconductor market trend 1992-2014 ($ billions) Exhibit 32: Impact of drivers and challenges Exhibit 33: Timeline for semiconductor wafer-size advances Exhibit 34: Growth of car shipments 2015-2020 Exhibit 35: Other prominent vendors in market Exhibit 36: Market snapshot of global fan-in WLP market 2015-2020 Exhibit 37: CAGR comparison: Application segments Exhibit 38: CAGR comparison: Geographical segments

STATS ChipPAC, STMicroelectronics, TSMC, Texas Instruments, Rudolph Technologies, SEMES, SUSS MicroTec, Ultratech, FlipChip International.