Table of Content PART 01: Executive summary • Highlights PART 02: Scope of the report • Definition • Source year and forecast period • Market overview • Segmentation • Geographical coverage • Vendor segmentation • Common currency conversion rates • Top-vendor offerings PART 03: Market research methodology • Research methodology • Economic indicators PART 04: Introduction • Key market highlights PART 05: Technology overview • Back-end chip formation • Wafer-level versus die-level packaging and assembly • Evolution of semiconductor packaging industry • Eco-system of semiconductor IC packaging industry PART 06: Market landscape • Market overview • Comparison between SoC, SiP, and chip-on-board (CoB) • Market size and forecast • Five forces analysis PART 07: Market segmentation by application • Communications sector • Consumer electronics sector • Computers sector • Automotive sector • Medical sector PART 08: Market segmentation by interconnect technology • Wire bond packaging • Flip-chip packaging PART 09: Market segmentation by end-user • Foundries • IDMs PART 10: Geographical segmentation • APAC • Americas • EMEA PART 11: Market drivers • Need to control rising costs • Emergence of advanced and compact consumer electronic devices • Rise in number of fabs • Increasing number of IoT devices • Design complexities in SoC PART 12: Impact of drivers PART 13: Market challenges • High inventory levels in supply chain • Fluctuation of foreign exchange rates • High investment market PART 14: Impact of drivers and challenges PART 15: Market trends • Growth of OSAT vendors • Emergence of FOWLP technology • Automation in automobiles PART 16: Vendor landscape • Competitive scenario • Key vendors • Other prominent vendors PART 17: Appendix • List of abbreviations PART 18: Explore Technavio   List of Exhibits Exhibit 01: Global SiP market segmentation Exhibit 02: List of countries in key geographies Exhibit 03: Market vendors Exhibit 04: Currency conversions Exhibit 05: Product offerings Exhibit 06: Back-end chip formation steps Exhibit 07:.5D IC block diagram Exhibit 08:D IC block diagram Exhibit 09: Old semiconductor IC packaging industry supply chain Exhibit 10: New semiconductor IC packaging industry supply chain Exhibit 11: SoC, SiP, and CoB ranking on functioning parameters Exhibit 12: Global SiP market 2015-2020 ($ billions) Exhibit 13: Five forces analysis Exhibit 14: Percentage share of SiP usage in applications (2015-2020) Exhibit 15: Percentage share of SiP usage in applications 2015-2020 ($ billions) Exhibit 16: Global SiP market for communications sector 2015-2020 ($ billions) Exhibit 17: Global SiP market for consumer electronics sector 2015-2020 ($ billions) Exhibit 18: Global SiP market for computer sector 2015-2020 ($ billions) Exhibit 19: Global SiP market for automotive sector 2015-2020 ($ billions) Exhibit 20: Expected automotive shipment forecast y-o-y (%) Exhibit 21: Global SiP market for medical sector 2015-2020 ($ billions) Exhibit 22: Bonding technologies for SiP, 2015-2020 (% share) Exhibit 23: Bonding technologies for SiP, 2015-2020 ($ billions) Exhibit 24: Global SiP market for wire bond packaging 2015-2020 ($ billions) Exhibit 25: Global SiP market for flip-chip packaging 2015-2020 ($ billions) Exhibit 26: Global SiP market by end-user 2015-2020 (% share) Exhibit 27: Global SiP market by end-user 2015-2020 ($ billions) Exhibit 28: Global SiP market of foundries 2015-2020 ($ billions) Exhibit 29: Global SiP market for IDMs 2015-2020 ($ billions) Exhibit 30: Global SiP market by geography 2015-2020 (% share) Exhibit 31: Global SiP market by geography 2015-2020 (% share) Exhibit 32: SiP market in APAC 2015-2020 ($ billions) Exhibit 33: SiP market in Americas 2015-2020 ($ billions) Exhibit 34: SiP market in EMEA 2015-2020 ($ billions) Exhibit 35: Impact of drivers Exhibit 36: Global semiconductor market trend 1992-2015 ($ billions) Exhibit 37: Impact of drivers and challenges Exhibit 38: Other vendors in global SiP market

Amkor Technology, ASE, JCET, SPIL, UTAC, ChipMOS Technology, ChipSiP Technology, NANIUM, Octavo Systems, Samsung Electro-Mechanics.