01. Executive Summary 02. List of Abbreviations 03. Scope of the Report 03.1 Market Overview 03.2 Product Offerings 04. Market Research Methodology 04.1 Market Research Process 04.2 Research Methodology 05. Introduction 06. Market Landscape 06.1 Technology Landscape 06.2 Market Size and Forecast by Value 06.3 Market Size and Forecast by Volume 06.5 Five Forces Analysis 07. Geographical Segmentation 07.1 Global e-Beam Wafer Inspection System Market by Geographical Segmentation 2013-2018 08. Key Leading Countries 08.1 Taiwan 08.2 South Korea 08.3 USA 09. Buying Criteria 10. Market Growth Drivers 11. Drivers and their Impact 12. Market Challenges 13. Impact of Drivers and Challenges 14. Market Trends 15. Trends and their Impact 16. Vendor Landscape 16.1 Competitive Scenario 16.2 Key Vendors in the Market 2013 16.3 Other Prominent Vendors 17. Key Vendor Analysis 17.1 Applied Materials Inc. 17.1.1 Business Overview 17.1.2 Business Segmentation 17.1.3 Key Information 17.1.4 SWOT Analysis 17.2 ASML Holding N.V. 17.2.1 Business Overview 17.2.2 Business Segmentation 17.2.3 Key Information 17.2.4 SWOT Analysis 17.3 Hermes Microvision Inc. 17.3.1 Business Overview 17.3.2 Business Segmentation 17.3.3 Key Information 17.3.4 SWOT Analysis 17.4 Hitachi High-Technologies Corp. 17.4.1 Business Overview 17.4.2 Business Segmentation 17.4.3 Key Information 17.4.4 SWOT Analysis 17.5 KLA-Tencor Corp. 17.5.1 Business Overview 17.5.2 Business Segmentation 17.5.3 Key Information 17.5.4 SWOT Analysis 17.6 Lam Research Corp. 17.6.1 Business Overview 17.6.2 Business Segmentation 17.6.3 Key Information 17.6.4 SWOT Analysis 18. Other Reports in this Series List of Exhibits Exhibit 1: Market Research Methodology Exhibit 2: Semiconductor Industry Value Chain Exhibit 3: E-beam Wafer Inspection Process Chart Exhibit 4: Global e-Beam Wafer Inspection System Market 2013-2018 (US$ million) Exhibit 5: Global e-Beam Wafer Inspection System Market 2013-2018 (Units) Exhibit 6: Global e-Beam Wafer Inspection System Market by Geographical Segmentation 2013-2018 Exhibit 7: Penetration of e-Beam Wafer Inspection System Vs Optical Wafer Inspection System 2013-2018 Exhibit 8: ASP of e-Beam Wafer Inspection System per Unit 2013-2018 (US$ million per unit) Exhibit 9: Applied Materials Business Segmentation 2013 Exhibit 10: ASML Holding N.V. Business Segmentation 2013 Exhibit 11: Hermes Microvision Inc. Business Segmentation 2013 Exhibit 12: Hitachi High-Technologies Corp. Business Segmentation 2013 Exhibit 13: KLA-Tencor Corp. Business Segmentation 2013 Exhibit 14: Lam Research Corp. Business Segmentation 2013

Applied Materials Inc., ASML Holding N.V., Hermes Microvision Inc., Hitachi High-Tech Corp., KLA-Tencor Corp., and Lam Research Corp.