PART 01: Executive summary • Highlights PART 02: Scope of the report • Definition • Source year and forecast period • Market reportage • Market size computation • Market segmentation • Geographical coverage • Vendor segmentation • Common currency conversion rates • Top-vendor offerings PART 03: Market research methodology • Research methodology • Economic indicators PART 04: Introduction • Key market highlights PART 05: Technology landscape • Wafer-level versus die-level packaging and assembly • Roadmap of semiconductor packaging industry • Ecosystem of semiconductor IC packaging industry PART 06: Market landscape • Customer perspective • Market size and forecast • Five forces analysis PART 07: Market segmentation by type • Types of packaging equipment • Die-level packaging equipment • Wafer-level packaging equipment PART 08: Market segmentation by end-user • Global semiconductor packaging equipment market by end-user • OSATs • IDMs PART 09: Geographical segmentation • Global semiconductor packaging equipment market by region • APAC • North America • Europe PART 10: Market drivers • Growing number of fabs • High demand for polymer adhesive wafer bonding equipment • Complex semiconductor IC designs • Explosive growth of wireless computing devices along with advent of IoT • Growing demand for compact electronic devices • High need for SoC technology PART 11: Impact of drivers PART 12: Market challenges • High inventory levels in supply chain • Dependency on few key suppliers • Fluctuation of foreign exchange rates • High investment market PART 13: Impact of drivers and challenges PART 14: Market trends • Development of 3D chip packaging • Increase in number of OSAT vendors • Growing number of mergers and acquisitions • FOWLP technology • High need for semiconductor memory devices • Growing acceptance of wearable devices • Automation in automobiles PART 15: Vendor landscape • Competitive scenario • Key vendors • Other prominent vendors PART 16: Appendix • List of abbreviations PART 17: Explore Technavio List of Exhibits Exhibit 01: Segmentation of global semiconductor packaging equipment market Exhibit 02: List of countries in key regions Exhibit 03: Market vendors Exhibit 04: Currency conversions Exhibit 05: Product offerings Exhibit 06: Steps involved in back-end chip formation Exhibit 07:.5D IC block diagram Exhibit 08:D IC block diagram Exhibit 09: Supply chain in traditional semiconductor IC packaging industry Exhibit 10: Supply chain in new semiconductor IC packaging industry Exhibit 11: Global semiconductor packaging equipment market 2015-2020 ($ billions) Exhibit 12: Five forces analysis Exhibit 13: Global semiconductor packaging equipment market by type 2015 (% share) Exhibit 14: Global semiconductor packaging equipment market by type 2020 (% share) Exhibit 15: Global semiconductor packaging equipment market by die-level packaging equipment 2015-2020 ($ millions) Exhibit 16: Global semiconductor packaging equipment market by wafer-level packaging equipment 2015-2020 ($ millions) Exhibit 17: Global semiconductor packaging equipment market by end-user 2015 (% share) Exhibit 18: Global semiconductor packaging equipment market by end-user 2020 (% share) Exhibit 19: Global semiconductor packaging equipment market by OSAT 2015-2020 ($ millions) Exhibit 20: Global semiconductor packaging equipment market by IDM 2015-2020 ($ millions) Exhibit 21: Global semiconductor packaging equipment market by region 2015 (% share) Exhibit 22: Global semiconductor packaging equipment market by region 2020 (% share) Exhibit 23: Semiconductor packaging equipment market in APAC 2015-2020 ($ millions) Exhibit 24: Semiconductor packaging equipment market in North America 2015-2020 ($ millions) Exhibit 25: Semiconductor packaging equipment market in Europe 2015-2020 ($ millions) Exhibit 26: Global semiconductor packaging equipment market 2015-2020 (% share) Exhibit 27: CAGR of LED chip and sensor market 2015-2020 Exhibit 28: Impact of drivers Exhibit 29: Impact of drivers (continued) Exhibit 30: Global semiconductor market trend 1992-2015 ($ billions) Exhibit 31: Impact of drivers and challenges Exhibit 32: CAGR of 3D NAND and DRAM 2015-2020 Exhibit 33: Cars shipment growth forecast 2015-2020 (% growth) Exhibit 34: Applied Materials: Segment-wise revenue contribution 2015 (% share) Exhibit 35: Applied Materials: Segment-wise revenue break-up 2015 ($ billions) Exhibit 36: Applied Materials: Silicon system segment performance 2014-2015 ($ billions) Exhibit 37: Applied Materials: R&D expenses 2011-2015 ($ billions) Exhibit 38: TEL: Sector performance by revenue 2012-2015 Exhibit 39: Tokyo Seimitsu: Business segmentation by revenue 2013-2015 ($ millions) Exhibit 40: Other vendors in global semiconductor packaging equipment market

Applied Materials, ASM Pacific Technology, Kulicke and Soffa Industries, Tokyo Electron Limited, Tokyo Seimitsu, ChipMos, Greatek, Hua Hong, Jiangsu Changjiang Electronics Technology, Lingsen Precision, Nepes, Tianshui Huatian¸ Unisem, Ultratech.