PART 01: Executive summary • Highlights PART 02: Scope of the report • Market overview • Definition • Source year and forecast period • Product segmentation • End-user segmentation • Geographical segmentation • Common currency conversion rates • Top-vendor offerings PART 03: Market research methodology • Research methodology • Economic indicators PART 04: Introduction • Key market highlights PART 05: Technology landscape • Technology landscape of wafer fab equipment • Wafer-level manufacturing equipment categories • Key customers PART 06: Market landscape • Market overview • Market size and forecast • Five forces analysis PART 07: Market segmentation by product • Market overview • Market size and forecast PART 08: Market segmentation by end-user • Market overview • Market size and forecast • Foundry • Memory • IDM PART 09: Geographical segmentation • Global FEOL semiconductor equipment market by geography • Market size and forecast • APAC • Americas • EMEA PART 10: Key leading countries • Taiwan • South Korea • Japan PART 11: Market drivers • Increase in number of fabs worldwide • Growth of advanced consumer electronics market • Miniaturization of electronic devices • Advent of 3D ICs PART 12: Impact of drivers PART 13: Market challenges • High cost of equipment • Long payback period • Fluctuations in the semiconductor industry PART 14: Impact of drivers and challenges PART 15: Market trends • Proliferation of automotive electronics • Growing number of connected devices through IoT and other emerging markets • Increasing investment in memory capacity • Shorter replacement cycle of smart devices • Adoption of FinFET architecture PART 16: Vendor landscape • Competitive scenario • Other prominent vendors PART 17: Explore Technavio List of Exhibits Exhibit 01: List of major countries considered Exhibit 02: Product offerings Exhibit 03: Semiconductor production equipment Exhibit 04: Semiconductor IC manufacturing process Exhibit 05: Front-end chip formation steps Exhibit 06: Back-end chip formation steps Exhibit 07: Wafer-level manufacturing equipment categories Exhibit 08: Requirements of a manufacturing equipment Exhibit 09: Global FEOL semiconductor equipment market 2015-2020 ($ billions) Exhibit 10: Five forces analysis Exhibit 11: Global FEOL semiconductor equipment market by product 2015-2020 (% share) Exhibit 12: Global FEOL semiconductor equipment market by product 2015-2020 ($ billions) Exhibit 13: Global FEOL semiconductor equipment market by end-user 2015-2020 (% share) Exhibit 14: Global FEOL semiconductor equipment market by end-user 2015-2020 ($ billions) Exhibit 15: Global FEOL semiconductor equipment market by foundry segment 2015-2020 ($ billions) Exhibit 16: Global FEOL semiconductor equipment market by memory segment 2015-2020 ($ billions) Exhibit 17: Global FEOL semiconductor equipment market by IDM segment 2015-2020 ($ billions) Exhibit 18: Global FEOL semiconductor equipment market by geography 2015-2020 (% share) Exhibit 19: Global FEOL semiconductor equipment market by geography 2015-2020 ($ billions) Exhibit 20: FEOL semiconductor equipment market in APAC 2015-2020 ($ billions) Exhibit 21: Global wearables market 2015-2020 ($ billions) Exhibit 22: FEOL semiconductor equipment market in Americas 2015-2020 ($ billions) Exhibit 23: FEOL semiconductor equipment market in EMEA 2015-2020 ($ billions) Exhibit 24: Global NAND flash market 2015-2020 (% share) Exhibit 25: Consumer electronics market 2015-2020 (unit shipment in millions) Exhibit 26: Global MEMS market 2015-2020 Exhibit 27: Impact of drivers Exhibit 28: Global semiconductor market trend 1990-2015 ($ billions) Exhibit 29: Impact of drivers and challenges Exhibit 30: Cars shipment growth forecast 2015-2020 (% growth) Exhibit 31: IoT spending and device penetration 2014, 2015, and 2020 Exhibit 32: CAGR of 3D NAND and DRAM 2015-2020 Exhibit 33: Key vendors Exhibit 34: ASML customers by end-user segment Exhibit 35: Other prominent vendors

Applied Materials, ASML, KLA-Tencor, Lam Research, Tokyo Electron, Dainippon Screen Manufacturing, Hitachi High-Technologies, Nikon, Hitachi Kokusai Electric