Wafer bonding is commonly used in Front-end of line (FEOL) operational steps as wafer-to-wafer bonding provides strength if the device wafer is to be thinned to ultra-thin dimensions. The statistic scope is wafer bonder in this report.

The global Wafer Bonders market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Wafer Bonders volume and value at global level, regional level and company level. From a global perspective, this report represents overall Wafer Bonders market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.

The following manufacturers are covered:
EV Group (EVG)
SUSS MicroTec
Dynatex International
AML
Mitsubishi Heavy Industries
Kulicke & Soffa Industries, Inc
Ayumi Industries Company Limited
Tokyo Electron Limited
Tokyo Ohka Kogyo Co., Ltd
Finetech GmbH & Co. KG

Segment by Regions
North America
Europe
China
Japan
South Korea

Segment by Type
Semi-Auto Type
Fully Automatic Type

Segment by Application
MEMS
Advanced Packaging (BSI CIS, CIS capping WLP, 3D stack TSV)
LED Devices
SOI Substrate
Others